Intel corporation (20240355792). REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE simplified abstract
Contents
REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE
Organization Name
Inventor(s)
Hazwani Jaffar of Kepala Batas (MY)
REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355792 titled 'REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE
The abstract of this patent application describes electronic packages that include a package substrate, a die, and a memory stack with a die stack structure coupled to a substrate extending laterally beyond the package substrate.
- The electronic package comprises a package substrate, a die, and a memory stack.
- The memory stack includes a die stack structure coupled to a substrate that extends laterally beyond the package substrate.
- The die stack structure consists of a stack of dies and through vias in a mold layer.
- The die stack structure is laterally spaced apart from the package substrate.
Potential Applications: - This technology can be used in the manufacturing of electronic devices such as smartphones, tablets, and laptops. - It can also be applied in the automotive industry for advanced driver assistance systems and infotainment systems.
Problems Solved: - Provides a compact and efficient way to integrate memory components into electronic packages. - Enhances the overall performance and functionality of electronic devices.
Benefits: - Improved memory storage capacity and data processing speed. - Enhanced reliability and durability of electronic packages. - Cost-effective manufacturing process for electronic devices.
Commercial Applications: Title: Advanced Electronic Packaging Technology for Enhanced Device Performance This technology can be utilized by electronic manufacturers to produce high-performance devices with increased memory capacity and processing speed, catering to the growing demand for faster and more efficient electronic products in the market.
Questions about Electronic Packages: 1. How does the lateral extension of the substrate beyond the package substrate impact the overall design and functionality of the electronic package?
The lateral extension allows for more efficient integration of memory components, leading to improved performance and compact design.
2. What are the potential challenges in implementing a die stack structure with through vias in a mold layer in electronic packages?
Some challenges may include ensuring proper alignment of the through vias and maintaining structural integrity during the manufacturing process.
Original Abstract Submitted
embodiments disclosed herein include electronic packages. in an example, an electronic package includes a package substrate. a die is coupled to the package substrate. the electronic package also includes a memory stack. the memory stack includes a die stack structure coupled to a substrate. the substrate is coupled to and is extending laterally beyond the package substrate. the die stack structure includes a stack of dies and through vias in a mold layer. the die stack structure is laterally spaced apart from the package substrate.
