Intel corporation (20240355768). MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS simplified abstract

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

Organization Name

intel corporation

Inventor(s)

Adel A. Elsherbini of Chandler AZ (US)

Krishna Bharath of Phoenix AZ (US)

Kevin P. O'brien of Portland OR (US)

Kimin Jun of Portland OR (US)

Han Wui Then of Portland OR (US)

Mohammad Enamul Kabir of Portland OR (US)

Gerald S. Pasdast of San Jose CA (US)

Feras Eid of Chandler AZ (US)

Aleksandar Aleksov of Chandler AZ (US)

Johanna M. Swan of Scottsdale AZ (US)

Shawna M. Liff of Scottsdale AZ (US)

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240355768 titled 'MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

The abstract describes microelectronic assemblies that involve direct bonding of microelectronic components, such as a first and second component connected by a direct bonding region containing part of an inductor.

• Microelectronic assemblies involve direct bonding of components
• Direct bonding region includes part of an inductor
• First and second microelectronic components are coupled together
• Structures and techniques related to direct bonding are discussed
• The technology aims to improve the integration of microelectronic components

Potential Applications: - Microelectronics manufacturing - Semiconductor industry - Electronics packaging

Problems Solved: - Enhanced connectivity between microelectronic components - Improved performance of microelectronic assemblies

Benefits: - Increased efficiency in microelectronics manufacturing - Enhanced reliability of microelectronic devices

Commercial Applications: Title: "Advanced Microelectronic Assembly Technology for Improved Performance" This technology can be utilized in the production of various electronic devices, leading to more reliable and efficient products. The market implications include improved competitiveness for companies in the semiconductor and electronics industries.

Questions about Microelectronic Assemblies: 1. How does direct bonding improve the performance of microelectronic components? Direct bonding enhances the connectivity between components, leading to better overall performance. 2. What are the potential challenges in implementing direct bonding in microelectronics manufacturing? Implementing direct bonding may require specialized equipment and expertise, which could pose challenges for some manufacturers.

Original Abstract Submitted

disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. for example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes at least part of an inductor.