Intel corporation (20240355759). LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DAMAGE simplified abstract
Contents
LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DAMAGE
Organization Name
Inventor(s)
Phil Geng of Washougal WA (US)
Baris Bicen of Chandler AZ (US)
Sanjoy Saha of Portland OR (US)
Prasanna Raghavan of Chandler AZ (US)
LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DAMAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355759 titled 'LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DAMAGE
The abstract discusses damping structures in integrated circuit (IC) devices and techniques for forming these structures. An IC device includes both a spring force and a damping structure between an IC package and a socket, adjacent to an array of pins and corresponding lands. The damping structure can be made of dissipative, viscous, or viscoelastic material and may be located between the IC package and socket, within the periphery of the socket, or coupled to either the IC package or socket using adhesive or a press fit. Additionally, a heatsink or heat spreader may be attached to the IC package over the socket.
- Damping structures in IC devices are crucial for reducing vibrations and enhancing stability.
- The damping structure can be made of dissipative, viscous, or viscoelastic material.
- It is positioned between the IC package and socket, within the socket's periphery, or attached to either component using adhesive or a press fit.
- A heatsink or heat spreader can be added to the IC package over the socket for additional cooling.
- These structures improve the overall performance and longevity of IC devices.
Potential Applications: - Consumer electronics - Automotive electronics - Aerospace technology
Problems Solved: - Minimizing vibrations in IC devices - Enhancing stability and performance - Improving the reliability of electronic systems
Benefits: - Increased durability and longevity of IC devices - Enhanced performance and stability - Reduced risk of damage due to vibrations
Commercial Applications: Title: "Enhancing Stability in Integrated Circuit Devices with Damping Structures" This technology can be utilized in various industries such as consumer electronics, automotive, and aerospace for improving the reliability and performance of electronic systems.
Questions about Damping Structures in IC Devices: 1. How do damping structures contribute to the stability of IC devices? Damping structures help reduce vibrations and enhance stability by absorbing excess energy and dissipating it as heat.
2. What materials are commonly used to create damping structures in IC devices? Damping structures can be made of dissipative, viscous, or viscoelastic materials to effectively reduce vibrations and improve overall performance.
Original Abstract Submitted
damping structures in integrated circuit (ic) devices, and techniques for forming the structures are discussed. an ic device includes, between an ic package and a socket, both a spring force and a damping structure adjacent an array of pins and corresponding lands. the damping structure may be of a dissipative, viscous, or viscoelastic material. the damping structure may be between the ic package and socket. the damping structure may be within a periphery of the socket. the damping structure may be coupled to the ic package or the socket by an adhesive or a press fit. a heatsink or a heat spreader may be coupled to the ic package over the socket.
