Intel corporation (20240355758). METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIATED INTEGRATED CIRCUIT PACKAGES HAVING GLASS CORES simplified abstract

METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIATED INTEGRATED CIRCUIT PACKAGES HAVING GLASS CORES

Organization Name

intel corporation

Inventor(s)

Steven Adam Klein of Chandler AZ (US)

Jason Gamba of Gilbert AZ (US)

Matthew Thomas Guzy of Phoenix AZ (US)

Nicholas Steven Haehn of Scottsdale AZ (US)

Tarek Adly Ibrahim of Mesa AZ (US)

Brandon Christian Marin of Gilbert AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Jacob John Schichtel of Chandler AZ (US)

METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIATED INTEGRATED CIRCUIT PACKAGES HAVING GLASS CORES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240355758 titled 'METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIATED INTEGRATED CIRCUIT PACKAGES HAVING GLASS CORES

Simplified Explanation: The patent application discloses systems, apparatus, articles of manufacture, and methods to reduce stress between sockets and integrated circuit packages with glass cores. An example integrated circuit package includes a semiconductor die and a substrate with a glass core.

• The integrated circuit package includes a semiconductor die and a substrate with a glass core.
• The substrate has a first surface for supporting the semiconductor die, a second surface with contacts for electrical coupling, and a third surface distinct from the glass core.
• The invention aims to reduce stress between sockets and integrated circuit packages with glass cores.

Key Features and Innovation:

• Integration of glass core in the substrate of an integrated circuit package.
• Design to reduce stress between sockets and integrated circuit packages.
• Use of distinct surfaces in the substrate to enhance performance.

Potential Applications: The technology can be applied in the semiconductor industry for manufacturing integrated circuit packages with glass cores. It can also find use in electronic devices requiring high-performance components.

Problems Solved:

• Reducing stress between sockets and integrated circuit packages.
• Enhancing the performance and reliability of integrated circuit packages with glass cores.

Benefits:

• Improved performance and reliability of integrated circuit packages.
• Reduction of stress-related issues in electronic devices.
• Potential cost savings in manufacturing processes.

Commercial Applications: Potential commercial applications include the production of high-performance electronic devices, such as smartphones, computers, and other consumer electronics. The technology can also benefit industries requiring advanced semiconductor components.

Questions about Glass Core Integrated Circuit Packages: 1. How does the use of a glass core in the substrate of integrated circuit packages improve performance? 2. What are the potential challenges in implementing this technology in mass production?

Frequently Updated Research: Stay updated on advancements in semiconductor packaging technologies and materials to enhance the performance and reliability of integrated circuit packages with glass cores. Regularly review industry publications and research studies for the latest developments in stress reduction techniques for electronic components.

Original Abstract Submitted

systems, apparatus, articles of manufacture, and methods to reduce stress between sockets and associated integrated circuit packages having glass cores are disclosed. an example integrated circuit package includes: a semiconductor die, and a substrate including a glass core. the substrate includes a first surface, a second surface opposite the first surface, and a third surface between the first surface and the second surfaces. the first surface supports the semiconductor die. the second surface includes first contacts to electrical couple with second contacts in a socket. at least a portion of the third surface separated and distinct from the glass core.