Intel corporation (20240355751). SELECTIVE UNDERCUT FOR GLASS CORE SUBSTRATE BRIDGE FIRST LEVEL INTERCONNECT (FLI) BUMP PLATING simplified abstract
Contents
SELECTIVE UNDERCUT FOR GLASS CORE SUBSTRATE BRIDGE FIRST LEVEL INTERCONNECT (FLI) BUMP PLATING
Organization Name
Inventor(s)
Sanjay Tharmarajah of Queen Creek AZ (US)
Hiroki Tanaka of Gilbert AZ (US)
Clayton Brenner of Chandler AZ (US)
SELECTIVE UNDERCUT FOR GLASS CORE SUBSTRATE BRIDGE FIRST LEVEL INTERCONNECT (FLI) BUMP PLATING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355751 titled 'SELECTIVE UNDERCUT FOR GLASS CORE SUBSTRATE BRIDGE FIRST LEVEL INTERCONNECT (FLI) BUMP PLATING
The abstract of this patent application describes an electronic package with a substrate, a pad, a layer over the pad, and an opening through the layer above the pad. An undercut at one end of the opening adjacent to the pad is provided, and a bump in the opening at least partially fills the undercut.
- The electronic package includes a substrate, a pad, a layer, an opening, an undercut, and a bump.
- The layer covers the pad and substrate, with sidewalls defining the opening.
- The undercut is positioned between the pad and the layer, providing stability.
- The bump in the opening fills the undercut, enhancing the structure of the package.
Potential Applications: This technology could be used in various electronic devices where stable and secure packaging is required, such as smartphones, tablets, and laptops.
Problems Solved: This innovation addresses the need for improved structural integrity in electronic packaging, ensuring the components are securely held in place.
Benefits: The electronic package design offers enhanced stability and protection for delicate electronic components, reducing the risk of damage during handling and use.
Commercial Applications: This technology could be valuable for electronics manufacturers looking to improve the durability and reliability of their products, potentially leading to increased customer satisfaction and brand loyalty.
Prior Art: Researchers interested in this technology may want to explore prior art related to electronic packaging, materials science, and microelectronics manufacturing processes.
Frequently Updated Research: Researchers in the field of microelectronics may be conducting ongoing studies on materials and designs for electronic packaging to enhance performance and durability.
Questions about Electronic Packaging: 1. How does the undercut in the opening contribute to the stability of the electronic package? 2. What are the potential implications of using this innovative packaging design in consumer electronics?
Original Abstract Submitted
embodiments disclosed herein include an electronic package. in an embodiment, the electronic package comprises a substrate and a pad on the substrate. in an embodiment, a layer is over the pad and the substrate, and an opening through the layer is above the pad. in an embodiment, sidewalls of the layer define the opening. in an embodiment, an undercut at an end of the opening adjacent to the pad is provided, where the undercut is positioned between the pad and the layer. in an embodiment, a bump is in the opening, where the bump at least partially fills the undercut
