Intel corporation (20240355749). DISAGGREGATED PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
Contents
DISAGGREGATED PACKAGE SUBSTRATES WITH GLASS CORES
Organization Name
Inventor(s)
Jeremy Ecton of Gilbert AZ (US)
Jefferson Coker Kaplan of Gilbert AZ (US)
Brandon Christian Marin of Gilbert AZ (US)
Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)
DISAGGREGATED PACKAGE SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355749 titled 'DISAGGREGATED PACKAGE SUBSTRATES WITH GLASS CORES
Simplified Explanation: The patent application describes package substrates with glass cores that have distinct blocks of redistribution layers on one side.
Key Features and Innovation:
- Package substrates with glass cores
- Distinct blocks of redistribution layers on one side of the glass core
- First block of redistribution layers is separate from the second block
Potential Applications: This technology could be used in semiconductor packaging, integrated circuits, and electronic devices.
Problems Solved: This technology addresses the need for efficient and reliable packaging solutions for electronic components.
Benefits:
- Improved reliability in electronic packaging
- Enhanced performance of integrated circuits
- Cost-effective manufacturing process
Commercial Applications: Glass core package substrates could revolutionize the semiconductor industry by providing more durable and efficient packaging solutions for electronic devices.
Questions about Glass Core Package Substrates: 1. How do glass core package substrates compare to traditional package substrates in terms of performance and reliability? 2. What are the potential cost savings associated with using glass core package substrates in electronic devices?
Frequently Updated Research: Researchers are constantly exploring new materials and manufacturing techniques to further improve the performance and reliability of glass core package substrates. Stay updated on the latest advancements in this field for potential future applications.
Original Abstract Submitted
disaggregated package substrates with glass cores are disclosed. an example package substrate includes a glass core having a first side and a second side opposite the first side. the example package substrate further includes a first block of redistribution layers on the first side of the glass core. the example package substrate also includes a second block of redistribution layers on the first side of the glass core. the first block is distinct from the second block.
