Intel corporation (20240355697). PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER TO AN INTEGRATED ROUTING LAYER simplified abstract
Contents
PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER TO AN INTEGRATED ROUTING LAYER
Organization Name
Inventor(s)
Lizabeth Keser of San Diego CA (US)
Thomas Wagner of Regelsbach (DE)
Bernd Waidhas of Pettendorf (DE)
PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER TO AN INTEGRATED ROUTING LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355697 titled 'PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER TO AN INTEGRATED ROUTING LAYER
The abstract of the patent application describes a semiconductor device with a die coupled to an integrated routing layer, where the integrated routing layer has a wider width than the die. Additionally, the device includes a molded routing layer coupled to the integrated routing layer.
- Die coupled to an integrated routing layer
- Integrated routing layer with wider width than the die
- Molded routing layer coupled to the integrated routing layer
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit design
Problems Solved: - Efficient routing of signals on semiconductor devices - Improved connectivity between components - Enhanced performance of electronic devices
Benefits: - Higher efficiency in signal routing - Better connectivity between components - Increased performance of semiconductor devices
Commercial Applications: Title: "Advanced Semiconductor Devices for Enhanced Connectivity" This technology can be used in the production of various electronic devices, such as smartphones, computers, and IoT devices, to improve their performance and connectivity. This innovation can lead to the development of faster and more reliable electronic products, which can attract a wide range of consumers in the market.
Questions about Semiconductor Devices: 1. How does the wider width of the integrated routing layer benefit the overall performance of the semiconductor device? The wider width of the integrated routing layer allows for more efficient signal routing and improved connectivity between components, leading to enhanced performance of the device.
2. What are the potential challenges in implementing the molded routing layer in semiconductor devices? The implementation of the molded routing layer may require additional manufacturing processes and materials, which could increase production costs and complexity. However, the benefits of improved connectivity and performance may outweigh these challenges in the long run.
Original Abstract Submitted
a semiconductor device and method is disclosed. devices shown include a die coupled to an integrated routing layer, wherein the integrated routing layer includes a first width that is wider than the die. devices shown further included a molded routing layer coupled to the integrated routing layer.
