Intel corporation (20240353912). INTERCONNECT FABRIC LINK WIDTH REDUCTION TO REDUCE INSTANTANEOUS POWER CONSUMPTION simplified abstract

INTERCONNECT FABRIC LINK WIDTH REDUCTION TO REDUCE INSTANTANEOUS POWER CONSUMPTION

Organization Name

intel corporation

Inventor(s)

Mohammed Tameem of Bangalore (IN)

Altug Koker of El Dorado Hills CA (US)

Kiran C. Veernapu of Bangalore (IN)

Abhishek R. Appu of El Dorado Hills CA (US)

Ankur N. Shah of Folsom CA (US)

Joydeep Ray of Folsom CA (US)

Travis T. Schluessler of Hillsboro OR (US)

Jonathan Kennedy of Bristol (GB)

INTERCONNECT FABRIC LINK WIDTH REDUCTION TO REDUCE INSTANTANEOUS POWER CONSUMPTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240353912 titled 'INTERCONNECT FABRIC LINK WIDTH REDUCTION TO REDUCE INSTANTANEOUS POWER CONSUMPTION

Simplified Explanation: The patent application describes techniques for reducing dynamic power consumption in a processor device, including dynamic link width adjustment based on throughput demand and a parallel processor with a dynamically configurable interconnect fabric.

Key Features and Innovation:

• Technique for dynamic link width adjustment based on throughput demand.
• Parallel processor with a dynamically configurable interconnect fabric.
• Focus on reducing dynamic power consumption within a processor device.

Potential Applications: The technology can be applied in various processor devices to optimize power consumption and performance.

Problems Solved: The technology addresses the challenge of reducing dynamic power consumption in processor devices while maintaining performance.

Benefits:

• Improved power efficiency in processor devices.
• Enhanced performance through dynamic link width adjustment.
• Flexibility in configuring interconnect fabric for parallel processors.

Commercial Applications: Potential commercial applications include data centers, high-performance computing systems, and mobile devices seeking to optimize power consumption and performance.

Prior Art: Readers can explore prior research on dynamic power management in processor devices and interconnect fabric configurations.

Frequently Updated Research: Stay informed about the latest advancements in dynamic power management and interconnect fabric optimization for processor devices.

Questions about reducing dynamic power consumption in processor devices: 1. How does dynamic link width adjustment impact power consumption in a processor device? 2. What are the potential implications of a dynamically configurable interconnect fabric on processor performance and power efficiency?

Original Abstract Submitted

described herein are various embodiments of reducing dynamic power consumption within a processor device. one embodiment provides a technique for dynamic link width adjustment based on throughput demand for client of an interconnect fabric. one embodiment provides for a parallel processor comprising an interconnect fabric including a dynamically configurable bus widths and frequencies.