Intel corporation (20240353631). SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE simplified abstract
Contents
SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE
Organization Name
Inventor(s)
Vivek Raghunathan of Tempe AZ (US)
Myung Jin Yim of San Jose CA (US)
SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240353631 titled 'SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE
The abstract of the patent application describes a semiconductor package that includes one or more optical die(s) embedded within it. These optical die(s) may have one or more interconnect layers on top of them, allowing for electrical contact. Additionally, an optical waveguide may be located next to the optical die and embedded within the semiconductor package, with an optical fiber optically coupled to the waveguide.
- Optical die(s) embedded in semiconductor package
- Interconnect layers on optical die(s) for electrical contact
- Optical waveguide next to optical die
- Optical fiber optically coupled to waveguide
- Integration of optical and electrical components in semiconductor package
Potential Applications: - High-speed data transmission - Optical communication systems - Fiber optic networks
Problems Solved: - Integration of optical and electrical components in a compact package - Efficient data transmission and communication
Benefits: - Improved data transmission speeds - Enhanced communication capabilities - Compact and efficient design
Commercial Applications: Title: "Optical-Electrical Integration in Semiconductor Packages" This technology could be used in telecommunications equipment, data centers, and networking devices to improve data transmission speeds and communication efficiency.
Questions about the technology: 1. How does the integration of optical and electrical components benefit data transmission? 2. What are the potential challenges in manufacturing semiconductor packages with embedded optical die(s)?
Original Abstract Submitted
semiconductor package with one or more optical die(s) embedded therein is disclosed. the optical die(s) may have one or more overlying interconnect layers. electrical contact to the optical die may be via the one or more overlying interconnect layers. an optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. an optical fiber may be optically coupled to the optical waveguide.
