18751913. ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME simplified abstract (Murata Manufacturing Co., Ltd.)

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ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Atsushi Sakurai of Nagaokakyo-shi (JP)

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18751913 titled 'ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

The patent application describes an electronic component with a unique structure involving multiple layers and a via conductor for electrical coupling.

  • The component includes a substrate, a first electrode layer with conductive fillers and a binder, an insulation layer with a via hole, a second electrode layer, and a via conductor connecting the first and second electrode layers.
  • A coupling layer in the first electrode layer overlaps with the via hole and has a lower binder content rate compared to the rest of the first electrode layer.
  • This design allows for efficient electrical coupling while minimizing the use of binder material, enhancing the component's performance and reliability.

Potential Applications:

  • This technology can be used in various electronic devices such as sensors, actuators, and circuit boards.
  • It can also be applied in industries requiring high-performance electronic components, such as aerospace and telecommunications.

Problems Solved:

  • Improved electrical coupling efficiency.
  • Reduced use of binder material.
  • Enhanced performance and reliability of electronic components.

Benefits:

  • Increased efficiency in electronic component design.
  • Enhanced performance and reliability.
  • Cost-effective production due to reduced material usage.

Commercial Applications:

  • This technology can be utilized in the manufacturing of electronic devices for various industries, potentially leading to improved product performance and reliability.

Questions about the technology: 1. How does the unique structure of this electronic component improve its performance compared to traditional designs? 2. What are the potential cost savings associated with using less binder material in electronic component production?


Original Abstract Submitted

An electronic component that includes: a substrate; a first electrode layer on the substrate and including conductive fillers and a binder; an insulation layer on the first electrode layer, the insulation layer having a via hole that penetrates the insulation layer in a lamination direction of the substrate, the first electrode layer, and the insulation layer; a second electrode layer on the insulation layer; and a via conductor in the via hole, the via conductor electrically coupling the first electrode layer and the second electrode layer, wherein a portion of the first electrode layer overlapping with the via hole in a top view includes a coupling layer coupled to the via conductor, the coupling layer having a content rate of the binder lower than a content rate of the binder in a portion of the first electrode layer positioned outside the via hole in the top view.

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