18681928. CONDUCTIVE LAYER STRUCTURE AND LIGHT EMITTING DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Contents
CONDUCTIVE LAYER STRUCTURE AND LIGHT EMITTING DEVICE
Organization Name
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Inventor(s)
Hidekazu Aoyagi of Kanagawa (JP)
Shinichi Suzuki of Kanagawa (JP)
Katsuharu Tanno of Kanagawa (JP)
Kazunari Saitou of Kanagawa (JP)
Takayuki Tanaka of Kanagawa (JP)
Kiyotaka Yashima of Kanagawa (JP)
Takashi Sugiyama of Kanagawa (JP)
Kentaro Fujii of Kanagawa (JP)
Hidehiko Nakata of Kanagawa (JP)
CONDUCTIVE LAYER STRUCTURE AND LIGHT EMITTING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18681928 titled 'CONDUCTIVE LAYER STRUCTURE AND LIGHT EMITTING DEVICE
Simplified Explanation: The patent application describes a conductive layer structure consisting of two conductive layers separated by an adhesion layer with conductivity. The second conductive layer is less likely to deteriorate than the adhesion layer and covers the end and upper surfaces of the adhesion layer while partially covering the first conductive layer.
- The structure includes a first conductive layer, a second conductive layer, and an adhesion layer with conductivity.
- The adhesion layer has higher adhesiveness to the conductive layers than the adhesiveness between the two conductive layers.
- The second conductive layer protects the adhesion layer and covers part of the first conductive layer.
- The second conductive layer is less prone to deterioration compared to the adhesion layer.
- The structure aims to improve the overall durability and performance of the conductive layer system.
Potential Applications: 1. Electronics manufacturing for improved circuitry. 2. Solar panel technology for enhanced conductivity. 3. Aerospace industry for reliable electrical connections.
Problems Solved: 1. Enhanced adhesion between conductive layers. 2. Improved durability and longevity of the conductive layer structure.
Benefits: 1. Increased reliability in electrical connections. 2. Extended lifespan of electronic components. 3. Enhanced performance in various applications.
Commercial Applications: The technology can be utilized in the manufacturing of electronic devices, solar panels, and aerospace components to improve conductivity and durability, leading to more reliable products in the market.
Questions about Conductive Layer Structure: 1. How does the adhesion layer contribute to the overall performance of the conductive layer structure? 2. What are the potential applications of this technology in the aerospace industry?
Frequently Updated Research: Ongoing research focuses on optimizing the composition of the adhesion layer to further enhance its conductivity and adhesiveness in various environments.
Original Abstract Submitted
A conductive layer structure includes a first conductive layer and a second conductive layer that is electrically coupled to the first conductive layer with an adhesion layer interposed. The adhesion layer has conductivity and has a higher adhesiveness to each of the first conductive layer and the second conductive layer than adhesiveness between the first conductive layer and the second conductive layer. The second conductive layer is less likely to deteriorate than the adhesion layer, and covers an end surface and an upper surface of the adhesion layer while covering a portion of the first conductive layer.
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hidekazu Aoyagi of Kanagawa (JP)
- Shinichi Suzuki of Kanagawa (JP)
- Katsuharu Tanno of Kanagawa (JP)
- Kazunari Saitou of Kanagawa (JP)
- Takayuki Tanaka of Kanagawa (JP)
- Kiyotaka Yashima of Kanagawa (JP)
- Takashi Sugiyama of Kanagawa (JP)
- Jugo Mitomo of Kanagawa (JP)
- Kentaro Fujii of Kanagawa (JP)
- Hidehiko Nakata of Kanagawa (JP)
- H01S5/042
- H01L33/40
- H01S5/183
- CPC H01S5/04256