18291364. SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Contents
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
Organization Name
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Inventor(s)
KAZUHIRO Tamura of KANAGAWA (JP)
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18291364 titled 'SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
Simplified Explanation: The semiconductor device described in the patent application aims to prevent faulty connections between different chips by utilizing a first chip with multiple wiring layers and a second chip mounted on the first chip with conductive portions.
Key Features and Innovation:
- First chip with insulating layer and multiple wiring layers
- Second chip with conductive portions mounted on the first chip
- Connecting structures between pad layers and conductive portions to prevent faulty connections
- Multiple pad layers formed in different wiring layers for enhanced connectivity
Potential Applications: This technology can be applied in various electronic devices where multiple chips need to be connected securely without the risk of faulty connections.
Problems Solved: The technology addresses the issue of faulty connections between different chips in semiconductor devices, ensuring reliable and stable connections.
Benefits:
- Enhanced reliability in chip-to-chip connections
- Improved performance of electronic devices
- Reduced risk of malfunctions due to faulty connections
Commercial Applications: The technology can be utilized in the manufacturing of smartphones, tablets, computers, and other electronic devices where secure chip-to-chip connections are crucial for optimal performance.
Prior Art: Readers can explore prior art related to chip-to-chip connection technologies in the field of semiconductor devices to gain a deeper understanding of the innovation presented in this patent application.
Frequently Updated Research: Researchers in the field of semiconductor devices may be conducting studies on improving chip-to-chip connection technologies, which could be relevant to the innovation described in this patent application.
Questions about Semiconductor Device Technology: 1. How does the technology described in the patent application improve chip-to-chip connections in electronic devices? 2. What are the potential implications of this innovation on the semiconductor industry?
By focusing on the lasting impact and relevance of the technology, this article provides a comprehensive overview of the semiconductor device described in the patent application.
Original Abstract Submitted
An object is to provide a semiconductor device and an electronic device that can suppress faulty connections between different chips. The semiconductor device includes: a first chip that includes an insulating layer and a plurality of wiring layers having wires formed in the insulating layer; and at least one second chip that is mounted on the first chip and includes a plurality of conductive portions, wherein the first chip includes a plurality of pad layers and connecting structures, each being formed to electrically connect the pad layer and the conductive portion, the plurality of pad layers being formed at least in the plurality of different wiring layers.
