18130718. HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING THE SAME simplified abstract (TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.)
Contents
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING THE SAME
Organization Name
TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
Inventor(s)
Feng Zhou of Ann Arbor MI (US)
Tianzhu Fan of Houston TX (US)
Ercan Mehmet Dede of Ann Arbor MI (US)
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18130718 titled 'HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING THE SAME
Simplified Explanation:
This patent application describes a method for creating a highly integrated power electronics embedded printed circuit board (PCB) with a cold plate assembly. The process involves bonding a cold plate substrate to one side of a power device-substrate assembly, bonding a multi-layer PCB to the other side of the power device-substrate assembly, and then bonding a cold plate manifold to the multi-layer PCB to form a cold plate in thermal communication with the power device.
Key Features and Innovation:
- Bonding a cold plate substrate and manifold to a power device-substrate assembly for efficient heat dissipation.
- Using a multi-layer PCB to enhance the integration of power electronics within the assembly.
- Utilizing 3D printing technology for creating the multi-layer PCB on the power device-substrate assembly.
- Reinforcing the bonding of the cold plate manifold to the multi-layer PCB with mechanical fasteners.
Potential Applications: This technology can be applied in various industries such as automotive, aerospace, renewable energy, and consumer electronics where high-performance power electronics with efficient heat dissipation are required.
Problems Solved: This technology addresses the challenge of integrating power electronics with effective thermal management in a compact and efficient manner.
Benefits:
- Improved heat dissipation for power electronics.
- Enhanced integration and compactness of power electronics components.
- Increased efficiency and reliability of power electronics systems.
Commercial Applications: Title: Highly Integrated Power Electronics Embedded PCB with Cold Plate Assembly: Commercial Applications and Market Implications This technology can be utilized in electric vehicles, solar inverters, data centers, and industrial automation systems to improve performance and reliability while reducing space and cost requirements.
Prior Art: Readers can explore prior patents related to power electronics integration, thermal management in PCBs, and 3D printing technologies for PCB fabrication.
Frequently Updated Research: Stay updated on advancements in power electronics integration, thermal management techniques, and additive manufacturing technologies for PCB production.
Questions about Highly Integrated Power Electronics Embedded PCB with Cold Plate Assembly: 1. How does this technology improve the efficiency of power electronics systems? 2. What are the potential cost savings associated with implementing this integrated PCB with cold plate assembly?
Original Abstract Submitted
A method of fabricating or manufacturing a highly integrated power electronics (IPEs) embedded printed circuit board (PCB)—cold plate assembly includes bonding a cold plate substrate onto a first side of a power device—substrate assembly, bonding a multi-layer PCB onto a second side of the power device—substrate assembly, and bonding a cold plate manifold onto the multi-layer PCB and forming a cold plate in thermal communication a power device of the power device—substrate assembly. The multi-layer PCB can be 3D printed onto the second side of the power device—substrate assembly and bonding of the cold plate manifold to the multi-layer PCB can be reinforced with mechanical fasteners.
