18133443. HETEROGENEOUSLY INTEGRATED LIQUID ELECTROLYTE POWERED PROCESSOR simplified abstract (Microsoft Technology Licensing, LLC)

HETEROGENEOUSLY INTEGRATED LIQUID ELECTROLYTE POWERED PROCESSOR

Organization Name

Microsoft Technology Licensing, LLC

Inventor(s)

Vaidehi Oruganti of Kirkland WA (US)

Bharath Ramakrishnan of Bellevue WA (US)

Husam Atallah Alissa of Redmond WA (US)

Christian L. Belady of Mercer Island WA (US)

HETEROGENEOUSLY INTEGRATED LIQUID ELECTROLYTE POWERED PROCESSOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 18133443 titled 'HETEROGENEOUSLY INTEGRATED LIQUID ELECTROLYTE POWERED PROCESSOR

The abstract describes a processing unit that includes a substrate, an electrical load, and a microfluidic volume. The electrical load is supported by the first surface of the substrate, while the microfluidic volume is positioned in the second surface of the substrate. The unit also includes a first electrode and a second electrode in the microfluidic volume, connected to the electrical load via first and second TSVs. An electrochemical fluid in the microfluidic volume provides power to the electrical load and dissipates heat from it.

• Substrate with electrical load and microfluidic volume
• First and second electrodes in the microfluidic volume
• First and second TSVs connecting electrodes to the electrical load
• Electrochemical fluid for power and heat dissipation

Potential Applications: - Power generation in small electronic devices - Cooling systems for electronic components - Microfluidic systems for energy conversion

Problems Solved: - Efficient power delivery and heat dissipation in small devices - Integration of microfluidic and electronic components

Benefits: - Improved energy efficiency - Enhanced thermal management - Compact design for portable electronics

Commercial Applications: Title: "Microfluidic Processing Unit for Efficient Power Delivery" This technology can be used in: - Wearable devices - IoT sensors - Medical implants

Questions about the technology: 1. How does the electrochemical fluid provide power to the electrical load? 2. What are the advantages of using microfluidic volumes for heat dissipation in electronic devices?

Original Abstract Submitted

A processing unit includes a substrate, an electrical load, and a microfluidic volume. The electrical load is supported by the first surface of the substrate, and the microfluidic volume is positioned in the second surface of the substrate. The processing unit includes a first electrode positioned in the microfluidic volume and a second electrode positioned in the microfluidic volume. A first TSV connects the first electrode to the electrical load, and a second TSV connects the second electrode to the electrical load. An electrochemical fluid is positioned in the microfluidic volume to provide electrical power to the electrical load and receive heat from the electrical load.