18575957. BOARD MODULE AND ELECTRICAL JUNCTION BOX simplified abstract (AUTONETWORKS TECHNOLOGIES, LTD.)

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BOARD MODULE AND ELECTRICAL JUNCTION BOX

Organization Name

AUTONETWORKS TECHNOLOGIES, LTD.

Inventor(s)

Shun Takamizawa of Yokkaichi-shi, Mie (JP)

BOARD MODULE AND ELECTRICAL JUNCTION BOX - A simplified explanation of the abstract

This abstract first appeared for US patent application 18575957 titled 'BOARD MODULE AND ELECTRICAL JUNCTION BOX

Simplified Explanation:

The patent application aims to enhance heat dissipation performance and reduce the distance between connected circuit boards. The innovation involves a board module with a unique connector design that improves thermal management.

  • The board module includes a first board with a circuit and a connector, connected to a second connector.
  • A through hole is formed in the first board, allowing for efficient heat dissipation.
  • The connector includes a housing and a terminal with a heat dissipation portion.
  • The heat dissipation portion is exposed to the second connector, aiding in thermal management.

Key Features and Innovation:

  • Improved heat dissipation performance.
  • Reduced distance between connected boards.
  • Unique connector design for efficient thermal management.

Potential Applications:

This technology can be applied in various electronic devices where heat dissipation is crucial, such as computers, servers, and industrial equipment.

Problems Solved:

This technology addresses the challenge of managing heat dissipation effectively in compact electronic devices with interconnected circuit boards.

Benefits:

  • Enhanced heat dissipation performance.
  • Improved overall reliability and longevity of electronic devices.
  • Space-saving design for compact electronic devices.

Commercial Applications:

Potential commercial applications include the manufacturing of high-performance computers, servers, and industrial equipment where efficient heat dissipation is essential for optimal performance.

Questions about Heat Dissipation Technology:

1. How does the unique connector design improve heat dissipation performance? 2. What are the potential applications of this technology in the electronics industry?

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Original Abstract Submitted

An object is to improve heat dissipation performance while reducing a distance between boards when circuits on the boards are electrically connected to each other. The board module includes a first board including a first circuit, and a first connector provided on the first board, and the first connector is connected to a second connector, a through hole is formed in the first board, the first connector includes a connector housing disposed in the through hole and a first terminal, the first terminal includes a first board-side end portion connected to the first circuit, a first terminal portion held by the connector housing, and a heat dissipation portion provided between a first board-side end portion and the first terminal portion and exposed as seen from the opposite side to the second connector with respect to the connector housing.

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