18027200. APPARATUS DIAGNOSTIC APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS SYSTEM, AND SEMICONDUCTOR APPARATUS MANUFACTURING SYSTEM simplified abstract (HITACHI HIGH-TECH CORPORATION)

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APPARATUS DIAGNOSTIC APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS SYSTEM, AND SEMICONDUCTOR APPARATUS MANUFACTURING SYSTEM

Organization Name

HITACHI HIGH-TECH CORPORATION

Inventor(s)

Satoru Matsukura of Tokyo (JP)

Yoshito Kamaji of Hsinchu (JP)

Nanako Tamari of Tokyo (JP)

Akira Kagoshima of Tokyo (JP)

Masahiro Sumiya of Tokyo (JP)

APPARATUS DIAGNOSTIC APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS SYSTEM, AND SEMICONDUCTOR APPARATUS MANUFACTURING SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 18027200 titled 'APPARATUS DIAGNOSTIC APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS SYSTEM, AND SEMICONDUCTOR APPARATUS MANUFACTURING SYSTEM

The patent application describes an apparatus diagnostic system that analyzes data from semiconductor manufacturing chambers to identify performance differences.

  • The system creates feature quantity map data for both reference chambers and calibration-target chambers by mapping feature quantities onto graphs with multiple parameters.
  • It then compares the patterns in the data to identify performance discrepancies between chambers, changes within a single chamber over time, or differences due to component replacement or cleaning.
  • By analyzing these differences, the system can pinpoint issues and optimize the performance of semiconductor manufacturing equipment.

Potential Applications: - Quality control in semiconductor manufacturing processes - Predictive maintenance for semiconductor apparatus - Optimization of chamber performance in semiconductor manufacturing facilities

Problems Solved: - Identifying performance variations in semiconductor manufacturing chambers - Streamlining maintenance and troubleshooting processes - Improving overall efficiency and productivity in semiconductor manufacturing

Benefits: - Enhanced quality control in semiconductor production - Cost savings through optimized maintenance schedules - Increased productivity and reduced downtime in manufacturing operations

Commercial Applications: Title: "Advanced Semiconductor Manufacturing Chamber Diagnostic System" This technology could be utilized by semiconductor manufacturers to improve the efficiency and reliability of their production processes. By implementing this diagnostic system, companies can enhance their quality control measures, reduce maintenance costs, and ultimately increase their competitiveness in the semiconductor market.

Questions about the technology: 1. How does the apparatus diagnostic system differentiate between performance differences caused by temporal changes and those resulting from component replacement? - The system analyzes patterns in the feature quantity map data to distinguish between these types of performance differences. 2. What are the key parameters used in mapping feature quantities onto graphs in the diagnostic process? - The axes representing a variety of parameters are utilized to create the feature quantity map data for analysis.


Original Abstract Submitted

An apparatus diagnostic apparatus that performs a computation process using data acquired from a semiconductor apparatus manufacturing apparatus having a reference chamber to create reference chamber feature quantity map data by mapping a feature quantity onto a graph having axes representing a plurality of parameters. The apparatus diagnostic apparatus also performs a computation process using data acquired from a semiconductor apparatus manufacturing apparatus having a calibration-target chamber to create calibration-target chamber feature quantity map data by mapping a feature quantity onto a graph having axes representing a plurality of parameters. Based on patterns observed in the reference chamber feature quantity map data and the calibration-target chamber feature quantity map data, the apparatus diagnostic apparatus identifies a performance difference between different chambers, a performance difference resulting from a temporal change of a single chamber, or a performance difference resulting from component replacement or component cleaning of a single chamber.