18634630. DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME simplified abstract (Robert Bosch GmbH)
Contents
- 1 DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Ceramic Substrate Heat Dissipation
- 1.13 Original Abstract Submitted
DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME
Organization Name
Inventor(s)
Andreas Burghardt of Stuttgart (DE)
DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18634630 titled 'DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME
Simplified Explanation
The device described in the patent application includes a ceramic substrate with layers of copper and brazing material on each side. The copper layers have trenches that help with heat dissipation.
- The device has a ceramic substrate with copper and brazing layers on each side.
- Copper layers have trenches for heat dissipation.
- The design helps with efficient heat transfer.
Key Features and Innovation
- Ceramic substrate with copper and brazing layers.
- Trenches in copper layers for heat dissipation.
- Efficient heat transfer design.
Potential Applications
This technology could be used in electronic devices, power systems, and other applications requiring efficient heat dissipation.
Problems Solved
This technology addresses the issue of heat buildup in electronic devices and power systems by providing an efficient heat transfer solution.
Benefits
- Improved heat dissipation.
- Enhanced performance of electronic devices.
- Increased reliability of power systems.
Commercial Applications
- Electronic devices
- Power systems
- Industrial machinery
Prior Art
Prior research in the field of heat dissipation technologies and ceramic substrates can provide valuable insights into similar innovations.
Frequently Updated Research
Ongoing research in materials science and thermal management could lead to further advancements in heat dissipation technologies.
Questions about Ceramic Substrate Heat Dissipation
How does the design of the copper layers contribute to heat dissipation?
The trenches in the copper layers provide increased surface area for heat transfer, improving overall thermal performance.
What are the potential challenges in implementing this technology in different applications?
Adapting the design to specific requirements of different applications and ensuring compatibility with existing systems could be potential challenges.
Original Abstract Submitted
A device including a ceramic substrate having a first side and an opposite second side. A first brazing layer is arranged on the first side in regions and a first copper layer is arranged on the first brazing layer. A second brazing layer is arranged on the second side and a second copper layer is arranged on the second brazing layer. The first copper layer has first trenches which extend from a surface of the first copper layer to the first side. The second copper layer has second trenches which extend from a surface of the second copper layer to at least one surface of the second brazing layer. The second copper layer can be conductively connected to a heat sink. The first trenches have first trench bottoms and the second trenches have second trench bottoms, wherein the first trench bottoms are wider than the second trench bottoms.
