18294158. METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD simplified abstract (Resonac Corporation)

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

Organization Name

Resonac Corporation

Inventor(s)

Kei Togasaki of Minato-ku, Tokyo (JP)

Kazuyuki Mitsukura of Minato-ku, Tokyo (JP)

Masaya Toba of Minato-ku, Tokyo (JP)

Kenichi Iwashita of Minato-ku, Tokyo (JP)

Keishi Ono of Minato-ku, Tokyo (JP)

Mao Narita of Minato-ku, Tokyo (JP)

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18294158 titled 'METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

The method described in the patent application involves manufacturing a wiring board by first forming a resist layer on a seed layer made of metal on a support body. A pattern is then formed on the resist layer through light exposure and development, exposing the seed layer in an opening. Finally, a copper plating layer is formed on the exposed seed layer through electrolytic plating.

• The seed layer's surface roughness on the side opposite the support body must be between 0.05 μm and 0.30 μm.
• The process involves light exposure, development, and electrolytic plating to create the wiring board.
• The use of a seed layer and resist layer helps in the precise formation of the wiring pattern.
• Copper plating ensures conductivity and durability of the wiring board.
• The method aims to improve the manufacturing process of wiring boards for various applications.

Potential Applications: - Electronics manufacturing - Printed circuit board production - Semiconductor industry

Problems Solved: - Precise patterning of wiring boards - Ensuring conductivity and durability of the boards

Benefits: - Improved manufacturing efficiency - Enhanced performance of wiring boards - Cost-effective production process

Commercial Applications: The technology can be utilized in the electronics industry for the mass production of high-quality wiring boards, catering to the growing demand for advanced electronic devices.

Questions about the technology: 1. How does the surface roughness of the seed layer affect the performance of the wiring board? 2. What are the advantages of using copper plating in the manufacturing process of wiring boards?

Original Abstract Submitted

A method for manufacturing a wiring board, including: forming a resist layer on a seed layer comprising a metal provided on a support body; forming a pattern including an opening to which the seed layer is exposed in the resist layer by light exposure and development of the resist layer, and forming a copper plating layer on the seed layer exposed into the opening by electrolytic plating, in this order. The arithmetic mean roughness Ra of the surface of the seed layer on a side opposite to the support body is 0.05 μm or more and 0.30 μm or less.