18301367. THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS simplified abstract (International Business Machines Corporation)

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

Organization Name

International Business Machines Corporation

Inventor(s)

SHIDONG Li of Hopewell Junction NY (US)

Kenneth Charles Marston of Poughquag NY (US)

Kalind Baraya of West Lafayette IN (US)

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18301367 titled 'THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

Semiconductor structures in this patent application are equipped with five different cooling elements directly bonded to a semiconductor chip. These cooling elements provide better thermal conductivity for the semiconductor structure compared to traditional carrier wafers.

• Cooling elements are directly bonded to the backside of a thinned semiconductor substrate or to the front side back-end-of-line (BEOL) interconnect wiring of the semiconductor chip.
• The cooling elements include a copper cooling element with water-filled microchannels, a silicon cooling element with water-filled microchannels, a silicon carbide plate, or a glass plate with copper-filled vias.
• The cooling element replaces a carrier wafer on semiconductor chips with backside BEOL interconnect wiring.
• Each cooling element is directly bonded to the semiconductor chip by a hybrid bond.

Potential Applications: - This technology can be applied in high-performance computing systems. - It can be used in advanced electronic devices to improve thermal management.

Problems Solved: - Enhanced thermal conductivity in semiconductor structures. - Improved cooling efficiency in high-power applications.

Benefits: - Better heat dissipation in semiconductor chips. - Increased reliability and performance of electronic devices.

Commercial Applications: Title: Advanced Thermal Management Solutions for Semiconductor Devices This technology can be utilized in data centers, telecommunications equipment, and automotive electronics to enhance thermal performance and overall reliability.

Questions about Semiconductor Cooling Technology: 1. How does this cooling technology compare to traditional methods in terms of efficiency and cost-effectiveness? 2. What are the potential challenges in implementing this cooling solution in mass-produced electronic devices?

Frequently Updated Research: Researchers are continuously exploring new materials and designs for cooling elements to further improve thermal management in semiconductor devices. Stay updated on the latest advancements in this field for potential future applications.

Original Abstract Submitted

Semiconductor structures are provided with five different cooling elements directly bonded to a semiconductor chip. The cooling element is directly bonded to the backside of a thinned semiconductor substrate or to the front side back-end-of-line (BEOL) interconnect wiring of the semiconductor chip. The cooling element replaces a carrier wafer on semiconductor chips with backside BEOL interconnect wiring. Each of the five cooling elements provide better thermal conductivity for the semiconductor structure when directly bonded to the front side BEOL interconnect wiring than the carrier wafer typically bonded to a semiconductor chip with backside BEOL interconnect wiring. The cooling element is one of a copper cooling element with water-filled microchannels, or a copper plate, a silicon cooling element with water-filled microchannels, a silicon carbide plate, or a glass plate with copper-filled vias. The cooling element is directly bonded to the semiconductor chip by a hybrid bond.