18047366. SEMICONDUCTOR CHIP AND TEST METHOD OF THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

SEMICONDUCTOR CHIP AND TEST METHOD OF THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Yeon Ho Jung of Suwon-si (KR)

Jong Wook Kye of Suwon-si (KR)

Min Woo Kwak of Seoul (KR)

Mi Joung Kim of Hwaseong-si (KR)

Chan Wook Park of Seongnam-si (KR)

Do Hoon Byun of Hwaseong-si (KR)

Kwan Seong Lee of Yongin-si (KR)

Jae Ho Lee of Incheon (KR)

Jae Seung Choi of Hwaseong-si (KR)

Hwang Ho Choi of Busan (KR)

SEMICONDUCTOR CHIP AND TEST METHOD OF THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18047366 titled 'SEMICONDUCTOR CHIP AND TEST METHOD OF THE SAME

Simplified Explanation

The abstract describes a semiconductor chip that includes a semiconductor device connected between a power supply voltage and a ground voltage. It also includes two ring oscillators connected to the power supply and ground voltages through supply and ground switches.

• The first ring oscillator is operated by the first supply and ground switches, which respond to a first control signal.
• The second ring oscillator is operated by the second supply and ground switches, which respond to a second control signal.

Potential applications of this technology:

• Integrated circuits and electronic devices that require precise timing and clock signals.
• Communication systems that rely on accurate timing for data transmission.
• Sensor devices that need synchronized operation for data collection and processing.

Problems solved by this technology:

• Provides a compact and efficient way to generate multiple clock signals on a semiconductor chip.
• Allows for independent control of each ring oscillator, enabling flexibility in timing and synchronization requirements.
• Reduces the need for external components and simplifies the overall circuit design.

Benefits of this technology:

• Improved performance and reliability of integrated circuits and electronic devices.
• Enhanced synchronization capabilities for communication systems, leading to better data transmission.
• Cost and space savings due to the integration of multiple ring oscillators on a single chip.

Original Abstract Submitted

A semiconductor chip includes a semiconductor device connected between a first node to which a power supply voltage is applied and a second node to which a ground voltage is applied, a first ring oscillator connected to the first node through a first supply switch and the second node through a first ground switch and a second ring oscillator connected to the first node through a second supply switch and the second node through a second ground switch, wherein the first supply and ground switches are configured to operate in response to a first control signal, thereby operating the first ring oscillator, and the second supply and ground switches are configured to operate in response to a second control signal, thereby operating the second ring oscillator.