18757145. DESKTOP ELECTRONIC DEVICE simplified abstract (Apple Inc.)

DESKTOP ELECTRONIC DEVICE

Organization Name

Apple Inc.

Inventor(s)

Brett W. Degner of Menlo Park CA (US)

Caitlin Elizabeth Kalinowski of San Francisco CA (US)

Richard D. Kosoglow of Sunnyvale CA (US)

Joshua D. Banko of Palo Alto CA (US)

David H. Narajowski of San Jose CA (US)

Jonathan L. Berk of Mountain View CA (US)

Michael E. Leclerc of Sunnyvale CA (US)

Michael D. Mcbroom of Leonard TX (US)

Asif Iqbal of Los Altos Hills CA (US)

Paul S. Michelsen of San Jose CA (US)

Mark K. Sin of Santa Clara CA (US)

Paul A. Baker of Los Altos CA (US)

Harold L. Sontag of Gilroy CA (US)

Wai Ching Yuen of Palo Alto CA (US)

Matthew P. Casebolt of Fremont CA (US)

Kevin S. Fetterman of Campbell CA (US)

Alexander C. Calkins of San Francisco CA (US)

Daniel L. Mcbroom of Leonard CA (US)

DESKTOP ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18757145 titled 'DESKTOP ELECTRONIC DEVICE

Simplified Explanation: The patent application describes an internal component and external interface arrangement for a cylindrical compact computing system, including a structural heat sink and a computing engine with internal components like a GPU board, CPU board, I/O interface board, interconnect board, and PSU.

Key Features and Innovation:

• Structural heat sink with a triangular shape within a cylindrical housing
• Computing engine with a generally triangular shape
• Internal components include GPU board, CPU board, I/O interface board, interconnect board, and PSU

Potential Applications: This technology could be used in compact computing systems for various industries such as aerospace, automotive, and consumer electronics.

Problems Solved: This technology addresses the need for efficient cooling and space-saving design in compact computing systems.

Benefits:

• Improved heat dissipation
• Space-efficient design
• Enhanced performance of computing systems

Commercial Applications: Potential commercial applications include compact desktop computers, industrial control systems, and embedded computing devices for IoT applications.

Prior Art: Readers can explore prior art related to compact computing systems, heat sink design, and internal component arrangements in cylindrical housings.

Frequently Updated Research: Stay updated on research related to compact computing systems, heat dissipation technologies, and advancements in GPU and CPU board designs.

Questions about the Technology: 1. What are the specific advantages of using a triangular-shaped heat sink in a cylindrical compact computing system? 2. How does the arrangement of internal components like GPU, CPU, and PSU contribute to the overall efficiency of the computing engine?

Original Abstract Submitted

An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (V/O) interface board, an interconnect board, and a power supply unit (PSU).