18623091. WIRING SUBSTRATE simplified abstract (IBIDEN CO., LTD.)
Contents
WIRING SUBSTRATE
Organization Name
Inventor(s)
Masashi Kuwabara of Ibi-gun (JP)
Susumu Kagohashi of Ogaki (JP)
WIRING SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18623091 titled 'WIRING SUBSTRATE
The abstract of this patent application describes a wiring substrate that includes a core substrate with a through-hole conductor, a resin insulating layer, a conductor layer with a seed layer and an electrolytic plating layer, and a via conductor connecting the through-hole conductor and conductor layer.
- The wiring substrate has a core substrate made of a glass substrate with a through hole.
- The through-hole conductor is formed in the through hole to allow electrical connections.
- The seed layer covers the inner wall surface of the insulating layer where the via conductor is formed.
- The seed layer has a first portion and a second portion that are electrically connected.
- The first portion of the seed layer is formed on the second portion.
Potential Applications: - This technology can be used in electronic devices that require efficient and reliable electrical connections. - It can be applied in the manufacturing of printed circuit boards and semiconductor devices.
Problems Solved: - Provides a solution for creating electrical connections between different layers of a wiring substrate. - Ensures stable and durable connections in electronic devices.
Benefits: - Improved electrical conductivity and signal transmission. - Enhanced reliability and longevity of electronic devices.
Commercial Applications: Title: Advanced Wiring Substrate Technology for Enhanced Electronic Devices This technology can be utilized in the production of smartphones, laptops, tablets, and other consumer electronics. It can also benefit industries such as telecommunications, automotive, and aerospace.
Questions about the technology: 1. How does this wiring substrate technology improve the performance of electronic devices? - This technology enhances electrical conductivity and ensures reliable connections, leading to improved device functionality. 2. What are the key advantages of using a wiring substrate with a seed layer and electrolytic plating layer? - The seed layer promotes adhesion and conductivity, while the electrolytic plating layer enhances durability and corrosion resistance.
Original Abstract Submitted
A wiring substrate includes a core substrate having a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer. The via conductor electrically connects the through-hole conductor and conductor layer. The via conductor includes the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a glass substrate and has a through hole penetrating through the glass substrate. The through-hole conductor is formed in the through hole. The seed layer is covering inner wall surface of the insulating layer in opening in which the via conductor is formed. The seed layer has a first portion and a second portion electrically connected to the first portion. That part of the first portion is formed on the second portion.
