18626395. WIRING SUBSTRATE simplified abstract (IBIDEN CO., LTD.)
Contents
WIRING SUBSTRATE
Organization Name
Inventor(s)
Masashi Kuwabara of Ibi-gun (JP)
Susumu Kagohashi of Ogaki (JP)
WIRING SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18626395 titled 'WIRING SUBSTRATE
The abstract of this patent application describes a wiring substrate with two build-up parts, each containing insulating and conductor layers, as well as via conductors. The first build-up part has smaller minimum wiring width and inter-wiring distance than the second build-up part. Each first conductor layer and via conductor consist of three layers with varying thicknesses.
- The wiring substrate has two build-up parts with different minimum wiring width and inter-wiring distance.
- Each first conductor layer and via conductor are composed of three layers with varying thicknesses.
- The first portion of the first layer covers the surface of the insulating layers, the second portion covers the inner wall surface of the via opening, and the third portion covers the bottom surface of the via opening.
Potential Applications: - This technology could be used in the manufacturing of high-density electronic devices. - It may find applications in advanced circuit boards for telecommunications equipment.
Problems Solved: - Addresses the need for increased wiring density in electronic devices. - Improves the efficiency of signal transmission in complex circuits.
Benefits: - Enhanced performance and reliability of electronic devices. - Allows for more compact and lightweight electronic products.
Commercial Applications: Title: Advanced Wiring Substrate Technology for High-Density Electronic Devices This technology could be utilized in the production of smartphones, tablets, and other portable electronic devices. It could also be beneficial in the development of high-speed data processing equipment for various industries.
Questions about Wiring Substrate Technology: 1. How does the thickness variation in the conductor layers contribute to the performance of the wiring substrate? - The thickness variation helps optimize signal transmission and reduce interference in the circuitry. 2. What are the potential cost implications of implementing this advanced wiring substrate technology? - While initial production costs may be higher, the long-term benefits of improved performance and reliability can outweigh the initial investment.
Original Abstract Submitted
A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The minimum wiring width in the first conductor layers is smaller than the minimum wiring width in the second conductor layers. The minimum inter-wiring distance in the first conductor layers is smaller than the minimum inter-wiring distance in the second conductor layers. Each first conductor layer and each via conductor include first and second layers. The first layer includes a first portion covering respective surface of the first insulating layers, a second portion covering inner wall surface in respective via opening in the first insulating layers, and a third portion covering bottom surface in the respective via opening. The thickness of the first portion is larger than the thickness of the second portion and larger than the thickness of the third portion.
