18626736. WIRING SUBSTRATE simplified abstract (IBIDEN CO., LTD.)
Contents
WIRING SUBSTRATE
Organization Name
Inventor(s)
Masashi Kuwabara of Ibi-gun (JP)
WIRING SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18626736 titled 'WIRING SUBSTRATE
The abstract of the patent application describes a wiring substrate with two build-up parts, each consisting of an insulating layer and a conductor layer. The wirings in the first build-up part have smaller minimum widths and inter-wiring distances compared to the second build-up part. The conductor layer in the first part includes a conductor pattern with three metal layers, where the widths of the metal layers vary.
- The wiring substrate has two build-up parts with different wiring characteristics.
- The wirings in the first build-up part are narrower and closer together than those in the second build-up part.
- The conductor layer in the first part consists of three metal layers with varying widths.
- The innovation allows for more intricate and dense wiring configurations in electronic devices.
- This technology enables more efficient use of space and improved performance in electronic circuits.
Potential Applications: - This technology can be applied in the manufacturing of high-density circuit boards for various electronic devices. - It can be used in the production of advanced semiconductor devices with complex wiring requirements.
Problems Solved: - Addresses the need for compact and efficient wiring solutions in electronic devices. - Solves challenges related to increasing the density of wiring without sacrificing performance.
Benefits: - Improved efficiency and performance in electronic circuits. - Enhanced space utilization for compact electronic devices.
Commercial Applications: Title: Advanced Wiring Substrate Technology for High-Density Electronic Devices This technology has potential commercial applications in the production of smartphones, tablets, laptops, and other electronic devices that require high-density circuitry.
Questions about Wiring Substrate Technology: 1. How does the varying widths of the metal layers in the conductor pattern impact the performance of the wiring substrate? The varying widths of the metal layers allow for different electrical properties and can optimize the performance of the wiring substrate for specific applications.
2. What are the key advantages of using a wiring substrate with two build-up parts in electronic devices? Having two build-up parts with different wiring characteristics allows for more flexibility in designing complex electronic circuits and achieving higher performance levels.
Original Abstract Submitted
A wiring substrate includes a first build-up part including an insulating layer and a conductor layer, and a second build-up part including an insulating layer and a conductor layer. The minimum wiring width of wirings in the conductor layer of the first build-up part is smaller than the minimum wiring width of wirings in the conductor layer of the second build-up part. The minimum inter-wiring distance of the wirings in the first part is smaller than the minimum inter-wiring distance of the wirings in the second part. The first build-up part is formed such that the conductor layer includes a conductor pattern including a first metal layer, a second metal layer, and a third metal layer. The width of the first metal layer is larger than the width of the second metal layer. The width of the third metal layer is larger than the width of the first metal layer.
