18232837. SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC LINER AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
Contents
SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC LINER AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
FENG-WEN Hsu of NEW TAIPEI CITY (TW)
SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC LINER AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18232837 titled 'SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC LINER AND METHOD OF MANUFACTURING THE SAME
The present application describes a semiconductor structure with a dielectric liner and a method for manufacturing this structure.
- The semiconductor structure includes a substrate, first and second bit line structures, a polysilicon layer, a dielectric liner, and a landing pad.
- The first bit line structure consists of a first conductive layer, a second conductive layer, and a first dielectric layer.
- The second bit line structure consists of a second dielectric layer, a third conductive layer, and a third dielectric layer.
- The polysilicon layer is surrounded by the first and second bit line structures.
- The dielectric liner surrounds at least a portion of the polysilicon layer.
- The landing pad is positioned over the polysilicon layer, the dielectric liner, and the second bit line structure.
Potential Applications: - This semiconductor structure can be used in memory devices, logic circuits, and other semiconductor applications. - It can improve the performance and reliability of integrated circuits.
Problems Solved: - The structure helps in reducing parasitic capacitance and improving signal integrity. - It enhances the overall efficiency and functionality of semiconductor devices.
Benefits: - Increased performance and reliability of semiconductor devices. - Enhanced signal integrity and reduced parasitic capacitance. - Improved efficiency and functionality of integrated circuits.
Commercial Applications: - This technology can be applied in the semiconductor industry for the development of advanced memory devices and logic circuits. - It has the potential to impact the market by offering more efficient and reliable semiconductor solutions.
Questions about the technology: 1. How does the dielectric liner contribute to the performance of the semiconductor structure?
The dielectric liner helps in reducing parasitic capacitance and improving signal integrity by surrounding the polysilicon layer.
2. What are the key advantages of using a polysilicon layer in this semiconductor structure?
The polysilicon layer enhances the conductivity and functionality of the device, contributing to its overall performance.
Original Abstract Submitted
The present application provides a semiconductor structure having dielectric liner and a manufacturing method of the semiconductor structure. The semiconductor structure includes a substrate; a first bit line structure, disposed over the substrate, comprising a first conductive layer, a second conductive layer disposed over the first conductive layer, and a first dielectric layer disposed over the second conductive layer; a second bit line structure, disposed over the substrate, comprising a second dielectric layer, a third conductive layer disposed over the second dielectric layer, and a third dielectric layer disposed over the third conductive layer; a polysilicon layer, disposed over the substrate and surrounded by the first bit line structure and the second bit line structure; a dielectric liner, surrounding at least a portion of the polysilicon layer; and a landing pad, disposed over the polysilicon layer, the dielectric liner and the second bit line structure.