18575957. BOARD MODULE AND ELECTRICAL JUNCTION BOX simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
Contents
BOARD MODULE AND ELECTRICAL JUNCTION BOX
Organization Name
SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor(s)
Shun Takamizawa of Yokkaichi-shi, Mie (JP)
BOARD MODULE AND ELECTRICAL JUNCTION BOX - A simplified explanation of the abstract
This abstract first appeared for US patent application 18575957 titled 'BOARD MODULE AND ELECTRICAL JUNCTION BOX
Simplified Explanation:
The patent application aims to enhance heat dissipation performance and reduce the distance between connected circuit boards. It involves a board module with a first board containing a circuit and a connector, which is linked to a second connector. The first connector includes a terminal with a heat dissipation portion exposed to the second connector.
- The innovation focuses on improving heat dissipation performance and reducing the distance between connected circuit boards.
- A board module with a first board containing a circuit and a connector is utilized.
- The first connector includes a terminal with a heat dissipation portion exposed to the second connector.
- Through holes are formed in the first board to facilitate the connection process.
- The design allows for efficient heat dissipation while maintaining electrical connections between boards.
Potential Applications:
This technology can be applied in various electronic devices and systems where efficient heat dissipation is crucial, such as:
- Computer systems
- Telecommunication equipment
- Automotive electronics
- Industrial machinery
Problems Solved:
The technology addresses the following issues:
- Improving heat dissipation performance in electronic devices
- Reducing the distance between connected circuit boards
- Enhancing overall system efficiency and reliability
Benefits:
The benefits of this technology include:
- Improved heat dissipation performance
- Enhanced system reliability
- Compact design for space-saving applications
Commercial Applications:
Title: Enhanced Heat Dissipation Technology for Electronic Devices
This technology can be commercially utilized in:
- Manufacturing of electronic devices
- Integration into various electronic systems
- Upgrading existing heat dissipation solutions in electronic equipment
Questions about Enhanced Heat Dissipation Technology for Electronic Devices:
1. How does this technology improve heat dissipation in electronic devices? 2. What are the potential applications of this technology in different industries?
Original Abstract Submitted
An object is to improve heat dissipation performance while reducing a distance between boards when circuits on the boards are electrically connected to each other. The board module includes a first board including a first circuit, and a first connector provided on the first board, and the first connector is connected to a second connector, a through hole is formed in the first board, the first connector includes a connector housing disposed in the through hole and a first terminal, the first terminal includes a first board-side end portion connected to the first circuit, a first terminal portion held by the connector housing, and a heat dissipation portion provided between a first board-side end portion and the first terminal portion and exposed as seen from the opposite side to the second connector with respect to the connector housing.
