18752312. CAMERA MODULE AND ELECTRONIC DEVICE COMPRISING CAMERA MODULE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

CAMERA MODULE AND ELECTRONIC DEVICE COMPRISING CAMERA MODULE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Hyosang An of Suwon-si (KR)

Hwajoong Jung of Suwon-si (KR)

Beomsik Kim of Suwon-si (KR)

Bongchan Kim of Suwon-si (KR)

Taehwan Kim of Suwon-si (KR)

Hyungjin Rho of Suwon-si, Gyeonggi-do (KR)

Jaeheung Park of Suwon-si (KR)

Kwangseok Byon of Suwon-si (KR)

Jonghoon Won of Suwon-si (KR)

CAMERA MODULE AND ELECTRONIC DEVICE COMPRISING CAMERA MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18752312 titled 'CAMERA MODULE AND ELECTRONIC DEVICE COMPRISING CAMERA MODULE

The abstract describes a camera module with an image sensor, a substrate connected to the image sensor, a bracket fixing the substrate, and a plate shielding the image sensor from the outside.

• Image sensor
• Substrate electrically connected to the image sensor
• Bracket fixing the substrate
• Plate shielding the image sensor
• Bracket formed by injection molding with the plate inserted into a mold

Potential Applications: - Mobile phones - Digital cameras - Surveillance systems

Problems Solved: - Protecting the image sensor from external elements - Ensuring proper functioning of the camera module

Benefits: - Improved durability - Enhanced image quality - Increased reliability

Commercial Applications: - Smartphone manufacturers - Camera equipment suppliers - Security system providers

Questions about Camera Module: 1. How does the plate shield the image sensor from external factors? 2. What materials are commonly used for the bracket in camera modules?

Frequently Updated Research: - Ongoing advancements in image sensor technology - Innovations in injection molding techniques for camera components

Original Abstract Submitted

A camera module according to various embodiments of the disclosure may include: an image sensor (); a substrate () electrically connected to the image sensor (); a bracket () configured to fix the substrate (); and a plate () disposed on the bracket () such that the width () of a surface of the plate () facing the image sensor () includes the width () of an area in which the image sensor () is disposed, thereby shielding at least a part of a space in which the image sensor () is disposed from the outside, wherein the bracket () may be formed by injection molding a material forming the bracket () in a state in which the plate () is inserted into a mold. Various other embodiments inferable from the specification are also possible