18427982. IMAGE SENSOR MODULE AND CAMERA MODULE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

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IMAGE SENSOR MODULE AND CAMERA MODULE INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Jang Hun Kim of Suwon-si (KR)

IMAGE SENSOR MODULE AND CAMERA MODULE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18427982 titled 'IMAGE SENSOR MODULE AND CAMERA MODULE INCLUDING THE SAME

The abstract describes an image sensor module that includes a sensor substrate with an image sensor, a guide plate with guide pins, and adhesive members.

  • Sensor substrate with image sensor and connector
  • Guide plate with guide pins and adhesive members
  • Designed to improve the assembly and functionality of image sensor modules

Potential Applications: - Camera systems - Surveillance systems - Medical imaging devices

Problems Solved: - Simplifies the assembly process of image sensor modules - Enhances the stability and durability of the module

Benefits: - Improved image sensor module performance - Increased efficiency in manufacturing processes

Commercial Applications: Title: Enhanced Image Sensor Modules for Advanced Camera Systems This technology can be used in the development of high-quality camera systems for various industries, including security, healthcare, and consumer electronics.

Questions about Image Sensor Modules: 1. How does the guide plate with guide pins improve the functionality of the image sensor module? The guide plate with guide pins helps align and secure the sensor substrate and guide plate, enhancing the overall stability and performance of the module.

2. What are the potential cost-saving benefits of using this innovative image sensor module technology? By streamlining the assembly process and improving the durability of the module, companies can reduce manufacturing costs and improve product quality.


Original Abstract Submitted

An image sensor module is provided. The image sensor module includes a sensor substrate including a first region on which an image sensor including an imaging plane is disposed, a second region configured to face the first region, and a third region including a connector; and a guide plate disposed between the first region and the second region, wherein the guide plate includes a plurality of guide pins that protrude from the guide plate toward the first region and the second region, and the guide plate includes adhesive members respectively disposed on a first surface facing the first region and a second surface facing the second region.