18584007. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18584007 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a lower redistribution wiring layer with lower redistribution wirings, an encapsulation structure, conductive bumps, and an adhesive layer.
- The encapsulation structure includes a core substrate with a cavity for at least one semiconductor chip, positioned so that the chip pads face the lower redistribution wiring layer.
- An upper redistribution wiring layer covers the upper surface of the core substrate and is electrically connected to the conductive structures of the core substrate.
- Key Features and Innovation:**
- Integration of a lower redistribution wiring layer with an encapsulation structure for semiconductor packaging.
- Use of conductive bumps to connect the lower redistribution wiring layer and the encapsulation structure.
- Placement of semiconductor chips in a cavity within the core substrate, enhancing electrical connections.
- Potential Applications:**
This technology can be applied in the manufacturing of advanced semiconductor packages for various electronic devices such as smartphones, tablets, and computers.
- Problems Solved:**
This innovation addresses the need for efficient and reliable electrical connections in semiconductor packaging, improving overall device performance and durability.
- Benefits:**
- Enhanced electrical connectivity between semiconductor chips and wiring layers.
- Improved structural integrity and protection for semiconductor components.
- Potential for increased functionality and performance in electronic devices.
- Commercial Applications:**
The technology can be utilized by semiconductor manufacturers to produce high-quality, reliable semiconductor packages for consumer electronics, automotive applications, and industrial equipment.
- Questions about Semiconductor Packaging:**
1. How does the integration of the lower redistribution wiring layer and the encapsulation structure improve semiconductor packaging? 2. What are the potential challenges in implementing this technology on a large scale?
- Frequently Updated Research:**
Ongoing research in semiconductor packaging focuses on enhancing the efficiency and reliability of electrical connections, as well as exploring new materials and manufacturing processes to further improve device performance.
Original Abstract Submitted
A semiconductor package includes a lower redistribution wiring layer having lower redistribution wirings; an encapsulation structure on the lower redistribution wiring layer; a plurality of conductive bumps between the lower redistribution wiring layer and the encapsulation structure; and an adhesive layer attaching the lower redistribution wiring layer and the encapsulation structure. The encapsulation structure includes a core substrate having a cavity formed therein, at least one semiconductor chip in the cavity such that a front surface on which chip pads are formed faces the lower redistribution wiring layer, and an upper redistribution wiring layer covering an upper surface of the core substrate and having upper redistribution wiring layers that are electrically connected to conductive structures of the core substrate.
