18391942. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18391942 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a package substrate with a power pad and a ground pad spaced apart in one direction, and two semiconductor chips stacked in a stepped shape in a perpendicular direction. Connection wires are used to electrically connect the substrate to the semiconductor chips, with the first chip having lower option pads and the second chip having upper option pads. A conductive wire connects the upper chip pads to the lower chip pads.
- Package substrate with power pad and ground pad
- Stacked semiconductor chips in a stepped shape
- Connection wires for electrical connection
- Lower option pads on the first chip
- Upper option pads on the second chip
Potential Applications: - Semiconductor industry - Electronics manufacturing - Integrated circuits
Problems Solved: - Efficient electrical connection in semiconductor packages - Space-saving design for stacked chips
Benefits: - Improved performance in semiconductor devices - Enhanced reliability in electrical connections - Compact design for space-constrained applications
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in various commercial applications such as mobile devices, computers, automotive electronics, and telecommunications equipment. The compact design and efficient electrical connections make it ideal for high-performance electronic devices.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the performance of semiconductor devices? This technology enhances performance by providing efficient electrical connections and a compact design for stacked chips.
2. What are the potential commercial applications of this semiconductor packaging technology? This technology can be used in various industries such as mobile devices, computers, automotive electronics, and telecommunications equipment.
Original Abstract Submitted
A semiconductor package includes a package substrate including a power pad and a ground pad that are spaced apart from each other in a first horizontal direction, first and second semiconductor chips on the package substrate, the first and second semiconductor chips being stacked in a stepped shape that extends in a second horizontal direction perpendicular to the first horizontal direction, and a plurality of connection wires that electrically connect the package substrate to the first semiconductor chip and/or the second semiconductor chip. The first semiconductor chip includes a plurality of lower option pads. The second semiconductor chip includes a plurality of upper option pads. The plurality of connection wires include a conductive wire that electrically connects at least one of first and second upper chip pads of the second semiconductor chip to at least one of the lower option pads of the first semiconductor chip.
