18409465. MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
Organization Name
Inventor(s)
Sangwook Park of Suwon-si (KR)
MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18409465 titled 'MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
The memory device described in the patent application includes a semiconductor substrate with wire bonding pads arranged in a first direction, signal redistribution patterns connecting the wire bonding pads to signal via pads on one side, and power redistribution patterns connected to wire bonding pads on the other side.
- The memory device features wire bonding pads, signal redistribution patterns, and power redistribution patterns on a semiconductor substrate.
- Signal redistribution patterns connect wire bonding pads to signal via pads, while power redistribution patterns connect wire bonding pads to power sources.
- The wire bonding pads are arranged in a first direction, with signal and power redistribution patterns on opposite sides in a second direction perpendicular to the first.
- This design allows for efficient signal and power distribution within the memory device.
- The layout of the wire bonding pads and redistribution patterns optimizes the performance and functionality of the memory device.
Potential Applications: - Memory devices in electronic devices such as smartphones, tablets, and computers. - Integrated circuits requiring efficient signal and power distribution. - High-performance computing systems and servers.
Problems Solved: - Efficient signal and power distribution within a memory device. - Optimization of layout for improved performance. - Enhanced functionality in electronic devices.
Benefits: - Improved signal integrity and power efficiency. - Enhanced overall performance of memory devices. - Greater reliability and longevity of electronic devices.
Commercial Applications: Title: "Efficient Signal and Power Distribution in Memory Devices" This technology can be utilized in the production of memory devices for various electronic applications, leading to improved performance and reliability. The market implications include increased demand for high-quality memory components in consumer electronics and industrial systems.
Questions about the technology: 1. How does the layout of wire bonding pads and redistribution patterns impact the performance of the memory device? 2. What are the specific advantages of having separate signal and power redistribution patterns in the memory device design?
Original Abstract Submitted
A memory device comprising: a semiconductor substrate; a plurality of wire bonding pads on the semiconductor substrate and arranged in a first direction; a plurality of signal redistribution patterns connecting first wire bonding pads among the plurality of wire bonding pads to a plurality of signal via pads, respectively, wherein the plurality of signal redistribution patterns are on a first side with respect to the plurality of wire bonding pads in a second direction that is perpendicular to the first direction; and a plurality of power redistribution patterns connected to second wire bonding pads among the plurality of wire bonding pads, respectively, wherein the plurality of power redistribution patterns are on a second side with respect to the plurality of wire bonding pads in the second direction, wherein the first and second directions are parallel with an upper surface of the semiconductor substrate.
