18368640. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18368640 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation: The patent application describes an upper redistribution wiring layer in a semiconductor package that includes a protective layer with an opening exposing a portion of the uppermost redistribution wiring, where a bonding pad is located.
- The protective layer is provided on at least one upper insulating layer.
- The opening in the protective layer exposes the uppermost redistribution wiring.
- A bonding pad is located on the uppermost redistribution wiring through the opening.
- The bonding pad includes a first plating pattern with a via pattern and a pad pattern.
- There is a second plating pattern on the first plating pattern, followed by a third plating pattern.
Key Features and Innovation:
- Protective layer with opening for exposing uppermost redistribution wiring.
- Bonding pad with multiple plating patterns for connectivity.
- Enhanced design for efficient semiconductor packaging.
Potential Applications: This technology can be applied in various semiconductor packaging processes where upper redistribution wiring layers are utilized.
Problems Solved:
- Ensures proper connectivity in semiconductor packages.
- Protects redistribution wiring from external elements.
Benefits:
- Improved reliability in semiconductor packaging.
- Enhanced performance due to efficient wiring design.
Commercial Applications: Potential commercial applications include semiconductor manufacturing, electronics industry, and integrated circuit production.
Prior Art: Prior art related to this technology may include patents or publications on semiconductor packaging design and wiring configurations.
Frequently Updated Research: Stay updated on advancements in semiconductor packaging technologies, materials, and processes to enhance the efficiency of this innovation.
Questions about Semiconductor Packaging: 1. How does this technology improve the reliability of semiconductor packages? 2. What are the key advantages of using multiple plating patterns in bonding pads for semiconductor packaging?
Original Abstract Submitted
An upper redistribution wiring layer of a semiconductor package includes a protective layer provided on at least one upper insulating layer and having an opening that exposes at least a portion of an uppermost redistribution wiring among second redistribution wirings, and a bonding pad provided on the uppermost redistribution wiring through the opening. The bonding pad includes a first plating pattern formed on the uppermost redistribution wiring, the first plating pattern including a via pattern provided in the opening and a pad pattern formed on the via pattern to be exposed from the opening, a second plating pattern on the second plating pattern, and a third plating pattern on the second plating pattern.
