18748765. SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD
Organization Name
Inventor(s)
Hyeonjeong Hwang of Suwon-si (KR)
Kyounglim Suk of Suwon-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18748765 titled 'SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD
The semiconductor package described in the patent application consists of a semiconductor chip, a lower redistribution layer, a lower passivation layer, an under bump metallization (UBM) pad, a UBM protective layer, and an outer connecting terminal.
- The lower redistribution layer includes lower insulating layers, lower redistribution patterns, and lower conductive vias.
- The lower passivation layer is located under the lower redistribution layer and has a recess at its bottom surface.
- The UBM pad is positioned in the recess of the lower passivation layer.
- The UBM protective layer covers the top surface and side surfaces of the UBM pad while being connected to the lower conductive vias.
- The outer connecting terminal is connected to the bottom surface of the UBM pad.
Potential Applications: - This technology can be used in various semiconductor packaging applications where precise connections and protection layers are required.
Problems Solved: - Provides a reliable and efficient method for connecting semiconductor chips within a package. - Offers enhanced protection for the semiconductor chip and its connections.
Benefits: - Improved reliability and performance of semiconductor packages. - Enhanced durability and protection for semiconductor chips. - Simplified manufacturing processes for semiconductor packaging.
Commercial Applications: - This technology can be applied in the production of various electronic devices such as smartphones, tablets, and computers, where compact and reliable semiconductor packaging is essential.
Questions about the technology: 1. How does the UBM protective layer contribute to the overall reliability of the semiconductor package? 2. What are the specific advantages of having a lower passivation layer with a recess in semiconductor packaging?
Original Abstract Submitted
A semiconductor package includes a semiconductor chip, a lower redistribution layer disposed under the semiconductor chip, the lower redistribution layer including a plurality of lower insulating layers, a plurality of lower redistribution patterns, and a plurality of lower conductive vias, a lower passivation layer disposed under the lower redistribution layer and provided with a recess at a bottom surface of the lower passivation layer, an under bump metallization (UBM) pad disposed in the first recess, a UBM protective layer disposed in the first recess and connected to the lower conductive vias while covering a top surface and opposite side surfaces of the UBM pad, and an outer connecting terminal connected to a bottom surface of the UBM pad. The bottom surface of the UBM pad is positioned at a first depth from the bottom surface of the lower passivation layer.
