Mitsubishi electric corporation (20240347492). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347492 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application consists of a multi-layer substrate and a semiconductor chip mounted on it using flip-chip mounting. The semiconductor chip contains an internal circuit and multiple pads on its front surface, with pillars formed on these pads. The multi-layer substrate has upper-surface electrodes and lower-surface electrodes connected through through holes. The pillars are joined to the upper-surface electrodes with solder. The pads include an electrode pad connected to the internal circuit and inspection pads in the four corners of the chip, not connected to the internal circuit, with a line connecting the adjacent inspection pads.
- Multi-layer substrate with semiconductor chip mounted by flip-chip mounting
- Plural pads and pillars on the semiconductor chip
- Upper-surface electrodes on the multi-layer substrate connected to lower-surface electrodes through through holes
- Inspection pads in the corners of the semiconductor chip for testing purposes
- Connection of inspection pads with a line for testing efficiency
Potential Applications: - Semiconductor manufacturing - Electronics testing and quality control - Integrated circuit design and development
Problems Solved: - Efficient testing of semiconductor devices - Improved connectivity between semiconductor chip and substrate - Enhanced reliability of electronic components
Benefits: - Streamlined testing processes - Increased reliability of semiconductor devices - Enhanced performance of electronic systems
Commercial Applications: Title: Advanced Semiconductor Testing and Mounting Technology This technology can be utilized in the semiconductor industry for manufacturing high-performance electronic devices with improved testing capabilities. It can also benefit companies involved in integrated circuit design and development by enhancing the reliability and performance of their products.
Questions about the technology: 1. How does the flip-chip mounting method improve the performance of semiconductor devices? 2. What are the advantages of using inspection pads in the corners of the semiconductor chip for testing purposes?
Original Abstract Submitted
a semiconductor device includes: a multi-layer substrate; and a semiconductor chip mounted on the multi-layer substrate by flip-chip mounting and having an internal circuit, wherein plural pads are formed on a front surface of the semiconductor chip, plural pillars are respectively formed on the plural pads, plural upper-surface electrodes are formed on an upper surface of the multi-layer substrate, plural lower-surface electrodes are formed on a lower surface of the multi-layer substrate and are respectively connected with the plural upper-surface electrodes via through holes, the plural pillars are joined to the plural upper-surface electrodes by solder, the plural pads include an electrode pad connected with the internal circuit and plural inspection pads formed in at least three parts in four corners on the front surface of the semiconductor chip and not connected with the internal circuit, and a line connects the adjacent inspection pads with each other.
