18131534. ADVANCED METHOD FOR CREATING ELECTROSTATIC CHUCK (ESC) MESA PATTERNS simplified abstract (Applied Materials, Inc.)
Contents
ADVANCED METHOD FOR CREATING ELECTROSTATIC CHUCK (ESC) MESA PATTERNS
Organization Name
Inventor(s)
Joseph Sommers of Roseville CA (US)
Joseph Behnke of San Jose CA (US)
Alexander Sulyman of San Francisco CA (US)
ADVANCED METHOD FOR CREATING ELECTROSTATIC CHUCK (ESC) MESA PATTERNS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18131534 titled 'ADVANCED METHOD FOR CREATING ELECTROSTATIC CHUCK (ESC) MESA PATTERNS
Simplified Explanation: The patent application describes an electrostatic chuck (ESC) with a substrate having a rough first surface and multiple mesas with rough second surfaces.
- The ESC includes a substrate with a rough first surface.
- The substrate has mesas extending from the first surface.
- Each mesa has a rough second surface.
- Both the first and second surface roughness are approximately 0.3 μm or lower.
Key Features and Innovation:
- ESC with rough surfaces for improved adhesion.
- Mesas on the substrate enhance gripping capabilities.
- Low surface roughness for precise control and stability.
Potential Applications:
- Semiconductor manufacturing.
- Thin film deposition processes.
- Wafer bonding applications.
Problems Solved:
- Enhanced adhesion in vacuum environments.
- Improved stability during manufacturing processes.
- Precise control over substrate positioning.
Benefits:
- Increased efficiency in manufacturing.
- Enhanced adhesion for delicate substrates.
- Improved overall product quality.
Commercial Applications: Electrostatic chucks with rough surfaces can be used in semiconductor manufacturing processes to improve adhesion and stability, leading to higher quality products and increased efficiency in production.
Questions about Electrostatic Chuck: 1. How does the rough surface of the ESC improve adhesion compared to smooth surfaces? 2. What are the specific advantages of using mesas on the substrate of the ESC?
Frequently Updated Research: Ongoing research in the field of electrostatic chucks focuses on further optimizing surface roughness for specific applications and improving overall performance in semiconductor manufacturing processes.
Original Abstract Submitted
Embodiments disclosed herein include an electrostatic chuck (ESC). In an embodiment, the ESC comprises a substrate with a first surface, where the first surface has a first surface roughness. The ESC may further comprise a plurality of mesas extending up from the first surface. In an embodiment, the plurality of mesas each include a second surface, where the second surface has a second surface roughness. In an embodiment the first surface roughness and the second surface roughness both have an average surface roughness Ra of approximately 0.3 μm or lower.
