18131212. HIGH TEMPERATURE METAL SEALS FOR VACUUM SEGREGATION simplified abstract (Applied Materials, Inc.)
Contents
HIGH TEMPERATURE METAL SEALS FOR VACUUM SEGREGATION
Organization Name
Inventor(s)
Muhannad Mustafa of Milpitas CA (US)
Sanjeev Baluja of Campbell CA (US)
HIGH TEMPERATURE METAL SEALS FOR VACUUM SEGREGATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18131212 titled 'HIGH TEMPERATURE METAL SEALS FOR VACUUM SEGREGATION
- Simplified Explanation:**
The patent application is for a pressure seal designed for a process chamber to reduce pumping time and improve processing efficiency at high temperatures.
- Key Features and Innovation:**
- Pressure seal with bottom, compressible middle, and top portions
- Reduces pumping time in processing chambers
- Enables processing of semiconductor substrates at temperatures above 350°C
- Improves sealing of processing chambers
- Potential Applications:**
The technology can be used in semiconductor manufacturing, chemical processing, and other high-temperature industrial processes.
- Problems Solved:**
The pressure seal addresses the need for efficient sealing in high-temperature processing chambers, reducing pumping time and improving overall processing efficiency.
- Benefits:**
- Faster processing times
- Improved efficiency in high-temperature environments
- Enhanced sealing capabilities for processing chambers
- Commercial Applications:**
The pressure seal technology can be applied in semiconductor fabrication facilities, chemical processing plants, and other industrial settings requiring high-temperature processing chambers.
- Questions about Pressure Seal Technology:**
1. How does the pressure seal technology improve processing efficiency in high-temperature environments? 2. What are the key features of the pressure seal that make it effective in reducing pumping time and improving sealing capabilities?
- Frequently Updated Research:**
Ongoing research in materials science and engineering may lead to advancements in pressure seal technology, further enhancing its performance and applications.
Original Abstract Submitted
Embodiments of the present disclosure are related to directed to a pressure seal for a process chamber. The pressure seal comprises a bottom portion, a compressible middle portion on the bottom portion, and a top portion on the compressible middle portion. The disclosed pressure seal is configured to reduce pumping time of a process region in an interior volume of a processing chamber compared to a process chamber that does not include a pressure seal. Processing chambers including the disclosed pressure seal are configured to process a semiconductor substrate at high temperatures, such as a temperature of greater than or equal to 350° C. Methods of sealing a processing chamber using the disclosed pressure seal are also described.
