18743884. LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED METHODS OF OPERATION simplified abstract (Micron Technology, Inc.)

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LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED METHODS OF OPERATION

Organization Name

Micron Technology, Inc.

Inventor(s)

Kevin Tetz of Boise ID (US)

Charles M. Watkins of Eagle ID (US)

LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED METHODS OF OPERATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18743884 titled 'LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED METHODS OF OPERATION

Simplified Explanation: The patent application describes solid-state lighting devices with improved thermal sinking capabilities, specifically focusing on a light-emitting diode (LED) device.

  • The LED device includes a heat sink, an LED die, and a phosphor.
  • A heat conduction path is in direct contact with both the phosphor and the heat sink.
  • The heat conduction path is designed to efficiently conduct heat from the phosphor to the heat sink.

Key Features and Innovation:

  • Integration of a heat sink, LED die, and phosphor in a solid-state lighting device.
  • Direct contact heat conduction path for efficient thermal management.
  • Improved heat dissipation capabilities for enhanced LED performance.

Potential Applications:

  • General lighting applications in residential, commercial, and industrial settings.
  • Automotive lighting for headlights, taillights, and interior lighting.
  • Display lighting for televisions, monitors, and signage.

Problems Solved:

  • Addressing thermal management issues in LED devices.
  • Enhancing the overall performance and longevity of solid-state lighting systems.

Benefits:

  • Improved efficiency and reliability of LED lighting.
  • Extended lifespan of LED devices.
  • Enhanced light output and color quality.

Commercial Applications: Potential commercial applications include:

  • LED lighting fixtures for various indoor and outdoor settings.
  • Automotive lighting systems for vehicles.
  • Display lighting solutions for electronic devices.

Questions about Solid State Lighting Devices: 1. How does the heat conduction path in the LED device contribute to its overall performance? 2. What are the key advantages of using a heat sink in conjunction with an LED die and phosphor in solid-state lighting devices?


Original Abstract Submitted

Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

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