18624811. SEMICONDUCTOR DIES WITH ROUNDED OR CHAMFERED EDGES simplified abstract (Micron Technology, Inc.)
Contents
SEMICONDUCTOR DIES WITH ROUNDED OR CHAMFERED EDGES
Organization Name
Inventor(s)
Christopher Glancey of Boise ID (US)
Koustav Sinha of Boise ID (US)
SEMICONDUCTOR DIES WITH ROUNDED OR CHAMFERED EDGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18624811 titled 'SEMICONDUCTOR DIES WITH ROUNDED OR CHAMFERED EDGES
The abstract of this patent application describes a semiconductor device assembly involving a semiconductor die with two main faces, multiple side faces, and either a rounded edge or a chamfered edge connecting the side faces to one of the main faces.
- Semiconductor die with two main faces and multiple side faces
- Side faces perpendicular to main faces
- Die with rounded edge or chamfered edge connecting side faces to main face
- Innovative design for semiconductor device assembly
- Potential improvement in device performance and durability
Potential Applications:
- Semiconductor manufacturing industry
- Electronics and technology sector
Problems Solved:
- Enhancing structural integrity of semiconductor devices
- Improving overall performance and reliability
Benefits:
- Increased durability of semiconductor devices
- Potentially higher performance levels
- Enhanced design flexibility
Commercial Applications:
- Semiconductor manufacturing companies
- Electronics manufacturers
- Research and development firms in the technology sector
Questions about Semiconductor Device Assemblies: 1. How does the design of the semiconductor die impact the overall performance of the device?
- The design of the semiconductor die can affect factors such as structural integrity, heat dissipation, and overall efficiency of the device.
2. What are the potential challenges in implementing this innovative design in semiconductor manufacturing processes?
- Challenges may include adapting existing manufacturing processes, ensuring compatibility with other components, and optimizing production costs.
Original Abstract Submitted
Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor die includes a first main face and an opposing second main face, the first main face and the second main face being spaced apart from one another in a direction. The semiconductor die may include a plurality of side faces disposed substantially perpendicular to the first main face and the second main face, the plurality of side faces extending between the first main face and the second main face in the direction. The semiconductor die may include one of a first rounded edge or a first chamfered edge, the one of the first rounded edge or the first chamfered edge connecting at least one side face, of the plurality of side faces, to the first main face.
