18618645. Semiconductor Device for Short Circuit Detection simplified abstract (Micron Technology, Inc.)
Contents
Semiconductor Device for Short Circuit Detection
Organization Name
Inventor(s)
TOMOHIRO Kitani of Higashihiroshima (JP)
Semiconductor Device for Short Circuit Detection - A simplified explanation of the abstract
This abstract first appeared for US patent application 18618645 titled 'Semiconductor Device for Short Circuit Detection
The patent application describes an apparatus with active regions in a semiconductor substrate, each surrounded by shallow trench isolation and divided into first and second active areas with a channel area in between. First wirings are coupled to the first active areas, while second wirings are coupled to the second active areas.
- Active regions in a semiconductor substrate divided into first and second active areas with a channel area in between
- First wirings connected to the first active areas, second wirings connected to the second active areas
- First wirings extend in a direction different from the longer side of the active regions, while second wirings extend in a direction different from both the first and second directions
Potential Applications: - Integrated circuits - Semiconductor devices - Electronics manufacturing
Problems Solved: - Efficient routing of wiring in semiconductor devices - Improved performance and functionality of integrated circuits
Benefits: - Enhanced signal transmission - Reduced interference between wirings - Increased overall efficiency of semiconductor devices
Commercial Applications: Title: "Advanced Semiconductor Device Wiring Technology for Enhanced Performance" This technology could be utilized in the production of high-performance electronic devices, leading to faster and more reliable products in various industries such as telecommunications, computing, and consumer electronics.
Questions about the technology: 1. How does the division of active regions into first and second areas improve the performance of the semiconductor device?
- The division allows for more efficient routing of wirings, reducing interference and enhancing signal transmission.
2. What are the potential challenges in implementing this advanced wiring technology in semiconductor manufacturing processes?
- Some challenges may include precise alignment of the wirings and ensuring compatibility with existing fabrication techniques.
Original Abstract Submitted
An apparatus includes: a semiconductor substrate: active regions in the semiconductor substrate, each of the active regions surrounded by a shallow trench isolation and each divided, at least in part, into a first active area and a second active area having a channel area therebetween; first wirings over the plurality of active regions, each of the first wirings coupled to the first active areas of corresponding ones of the active regions; and second wirings over the active regions, each of the second wirings coupled to the second active areas of associated ones of the active regions. Each of the active regions has a longer side in a first direction, each of the first wirings extends in a second direction different from the first direction and each of the second wirings extends in a third direction different from each of the first direction and the second direction.
