18610268. SEMICONDUCTOR DEVICE WITH A THROUGH DIELECTRIC VIA simplified abstract (Micron Technology, Inc.)

SEMICONDUCTOR DEVICE WITH A THROUGH DIELECTRIC VIA

Organization Name

Micron Technology, Inc.

Inventor(s)

Bharat Bhushan of Taichung (TW)

Nevil N. Gajera of Meridian ID (US)

Akshay N. Singh of Boise ID (US)

Kunal R. Parekh of Boise ID (US)

SEMICONDUCTOR DEVICE WITH A THROUGH DIELECTRIC VIA - A simplified explanation of the abstract

This abstract first appeared for US patent application 18610268 titled 'SEMICONDUCTOR DEVICE WITH A THROUGH DIELECTRIC VIA

Simplified Explanation:

This patent application discloses a semiconductor device with a through dielectric via that can provide power to the semiconductor die.

• The semiconductor device assembly includes a semiconductor die and multiple stacks of semiconductor dies coupled at different lateral locations.
• Dielectric material is placed at the semiconductor die between the multiple stacks of semiconductor dies.
• The through dielectric via extends through the dielectric material to the semiconductor die, allowing it to connect with circuitry at the semiconductor die.
• The through dielectric via can supply power exclusively to the semiconductor die, separate from the multiple stacks of semiconductor dies.

Key Features and Innovation:

• Through dielectric via for power supply
• Multiple stacks of semiconductor dies
• Dielectric material between stacks
• Connection with circuitry at semiconductor die

Potential Applications:

• Integrated circuits
• Power management systems
• Semiconductor devices

Problems Solved:

• Efficient power distribution
• Enhanced circuit connectivity

Benefits:

• Improved power supply
• Enhanced performance
• Compact design

Commercial Applications:

Potential commercial applications include:

• Consumer electronics
• Automotive electronics
• Industrial automation

Questions about Semiconductor Device with Through Dielectric Via:

1. How does the through dielectric via enhance power distribution in the semiconductor device? 2. What are the advantages of having multiple stacks of semiconductor dies in the assembly?

Original Abstract Submitted

A semiconductor device with a through dielectric via is disclosed. The semiconductor device assembly can include a semiconductor die and multiple stacks of semiconductor dies coupled with the semiconductor die at different lateral locations. Dielectric material can be disposed at the semiconductor die between the multiple stacks of semiconductor dies. The through dielectric via can extend entirely through the dielectric material to the semiconductor die such that the through dielectric via couples with circuitry at the semiconductor die. In this way, the through dielectric via can provide power to the semiconductor die (e.g., exclusive of the multiple stacks of semiconductor dies).