18744493. MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MICROFEATURE WORKPIECES simplified abstract (Micron Technology, Inc.)
Contents
MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MICROFEATURE WORKPIECES
Organization Name
Inventor(s)
William M. Hiatt of Eagle ID (US)
Ross S. Dando of Nampa ID (US)
MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MICROFEATURE WORKPIECES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18744493 titled 'MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MICROFEATURE WORKPIECES
Simplified Explanation: This patent application discloses methods for forming interconnects in microfeature workpieces, where the interconnects extend from a terminal to an intermediate depth in the substrate and project from the substrate after material removal.
- Electrically conductive interconnects are constructed in microfeature workpieces.
- Interconnects extend from a terminal to an intermediate depth in the substrate.
- Material is removed from the substrate to expose a portion of the interconnect projecting from the substrate.
- The interconnect is electrically connected to the terminal.
- The methods enable the creation of interconnects in microfeature workpieces efficiently.
Potential Applications: 1. Microelectronics manufacturing. 2. Semiconductor device fabrication. 3. MEMS (Microelectromechanical Systems) production.
Problems Solved: 1. Facilitates the creation of reliable interconnects in microfeature workpieces. 2. Enables efficient electrical connections in small-scale devices. 3. Improves the overall performance and functionality of microfeature workpieces.
Benefits: 1. Enhanced electrical connectivity. 2. Increased reliability of interconnects. 3. Improved manufacturing efficiency. 4. Enhanced performance of microfeature devices.
Commercial Applications: Microelectronics Industry: The technology can be utilized in the production of various microelectronic devices, enhancing their performance and reliability.
Prior Art: Prior research in microelectronics and semiconductor manufacturing may provide insights into similar methods for forming interconnects in microfeature workpieces.
Frequently Updated Research: Ongoing research in microfabrication techniques and materials may lead to advancements in forming interconnects in microfeature workpieces.
Questions about Microfeature Interconnects: 1. How do these methods compare to traditional interconnect formation techniques in microfeature workpieces? 2. What are the potential challenges in scaling up these methods for mass production in the microelectronics industry?
Original Abstract Submitted
Methods for forming interconnects in microfeature workpieces, and microfeature workpieces having such interconnects are disclosed herein. The microfeature workpieces may have a terminal and a substrate with a first side carrying the terminal and a second side opposite the first side. In one embodiment, a method includes (a) constructing an electrically conductive interconnect extending from the terminal to at least an intermediate depth in the substrate with the interconnect electrically connected to the terminal, and (b) removing material from the second side of the substrate so that a portion of the interconnect projects from the substrate.
