18477364. SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE SIGNAL CONTROL CIRCUIT simplified abstract (SK hynix Inc.)
Contents
SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE SIGNAL CONTROL CIRCUIT
Organization Name
Inventor(s)
Ki Yong Lee of Icheon-si Gyeonggi-do (KR)
SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE SIGNAL CONTROL CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18477364 titled 'SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE SIGNAL CONTROL CIRCUIT
The semiconductor package described in the abstract consists of a package substrate, multiple memory chips stacked on the substrate, and a control chip positioned above the memory chips.
- The control chip includes various control pads for transmitting chip enable signals to and from the memory chips and an external electronic device.
- A chip enable signal control circuit within the control chip manages the transmission paths of the chip enable signals between the control pads.
- The control chip also features a specific control pad that receives a path control signal from the external electronic device to regulate the chip enable signal control circuit.
Potential Applications: - This technology could be used in various electronic devices that require efficient memory chip control. - It may find applications in data storage systems, consumer electronics, and industrial equipment.
Problems Solved: - The technology addresses the need for precise control and communication between memory chips and external devices. - It streamlines the management of chip enable signals within a semiconductor package.
Benefits: - Improved performance and reliability of memory chip communication. - Enhanced functionality and flexibility in controlling memory chips in electronic devices.
Commercial Applications: Title: Advanced Semiconductor Package for Enhanced Memory Chip Control This technology could be valuable in the development of high-performance computing systems, data centers, and IoT devices. It offers a more efficient and reliable way to manage memory chip operations, leading to enhanced overall device performance.
Questions about the technology: 1. How does this semiconductor package improve the communication between memory chips and external devices? 2. What are the key advantages of using a control chip in this semiconductor package design?
Original Abstract Submitted
A semiconductor package includes a package substrate, a plurality of memory chips stacked over the package substrate, and a control chip disposed over the package substrate to be spaced apart from the plurality of memory chips. The control chip includes a plurality of first chip enable signal control pads transmitting chip enable signals to and from the plurality of memory chips, a plurality of second chip enable signal control pads transmitting the chip enable signals to and from an external electronic device external to the semiconductor package, a chip enable signal control circuit configured to control transmission paths of the chip enable signals between the plurality of first chip enable signal control pads and the plurality of second chip enable signal control pads, and a third chip enable signal control pad receiving a path control signal from the external electronic device for controlling the chip enable signal control circuit.
