Sony semiconductor solutions corporation (20240348009). CONDUCTIVE LAYER STRUCTURE AND LIGHT EMITTING DEVICE simplified abstract

CONDUCTIVE LAYER STRUCTURE AND LIGHT EMITTING DEVICE

Organization Name

sony semiconductor solutions corporation

Inventor(s)

Hidekazu Aoyagi of Kanagawa (JP)

Shinichi Suzuki of Kanagawa (JP)

Katsuharu Tanno of Kanagawa (JP)

Kazunari Saitou of Kanagawa (JP)

Takayuki Tanaka of Kanagawa (JP)

Kiyotaka Yashima of Kanagawa (JP)

Takashi Sugiyama of Kanagawa (JP)

Jugo Mitomo of Kanagawa (JP)

Kentaro Fujii of Kanagawa (JP)

Hidehiko Nakata of Kanagawa (JP)

CONDUCTIVE LAYER STRUCTURE AND LIGHT EMITTING DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240348009 titled 'CONDUCTIVE LAYER STRUCTURE AND LIGHT EMITTING DEVICE

The abstract describes a conductive layer structure consisting of a first conductive layer, a second conductive layer, and an adhesion layer with conductivity. The adhesion layer has higher adhesiveness to the first and second conductive layers than the adhesiveness between the two conductive layers. The second conductive layer covers the end and upper surfaces of the adhesion layer and a portion of the first conductive layer.

• The structure includes a first conductive layer, a second conductive layer, and an adhesion layer with conductivity.
• The adhesion layer has higher adhesiveness to the first and second conductive layers than the adhesiveness between the two conductive layers.
• The second conductive layer covers the end and upper surfaces of the adhesion layer and a portion of the first conductive layer.
• The second conductive layer is less likely to deteriorate than the adhesion layer.
• The structure provides improved electrical coupling and durability.

Potential Applications: - Electronic devices - Printed circuit boards - Wearable technology - Aerospace industry

Problems Solved: - Enhanced electrical conductivity - Improved adhesion between layers - Increased durability and longevity

Benefits: - Improved performance of electronic devices - Longer lifespan of conductive layer structures - Enhanced reliability in various applications

Commercial Applications: Title: Enhanced Conductive Layer Structure for Electronics Industry This technology can be utilized in the manufacturing of electronic devices, printed circuit boards, and other electronic components. It offers improved conductivity, adhesion, and durability, making it a valuable asset in the electronics industry.

Questions about the technology: 1. How does the adhesion layer contribute to the overall performance of the conductive layer structure? The adhesion layer enhances the adhesiveness between the first and second conductive layers, improving the overall durability and reliability of the structure.

2. What are the potential drawbacks of using a conductive layer structure with an adhesion layer? While the adhesion layer improves the adhesiveness between layers, it may introduce additional complexity to the manufacturing process and increase production costs.

Original Abstract Submitted

a conductive layer structure includes a first conductive layer and a second conductive layer that is electrically coupled to the first conductive layer with an adhesion layer interposed. the adhesion layer has conductivity and has a higher adhesiveness to each of the first conductive layer and the second conductive layer than adhesiveness between the first conductive layer and the second conductive layer. the second conductive layer is less likely to deteriorate than the adhesion layer, and covers an end surface and an upper surface of the adhesion layer while covering a portion of the first conductive layer.