Sony semiconductor solutions corporation (20240347682). SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
Organization Name
sony semiconductor solutions corporation
Inventor(s)
KAZUHIRO Tamura of KANAGAWA (JP)
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347682 titled 'SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
The semiconductor device described in the abstract aims to prevent faulty connections between different chips. It consists of a first chip with multiple wiring layers and a second chip mounted on the first chip with conductive portions.
- The first chip includes an insulating layer and multiple wiring layers with wires embedded in the insulating layer.
- The second chip has multiple conductive portions.
- The first chip also features pad layers and connecting structures to electrically link the pad layer with the conductive portion.
- The pad layers are formed in different wiring layers within the first chip.
Potential Applications: - This technology can be applied in various electronic devices where multiple chips need to be interconnected securely. - It can be used in smartphones, computers, and other gadgets that require reliable connections between chips.
Problems Solved: - Prevents faulty connections between chips, ensuring the proper functioning of electronic devices. - Enhances the overall performance and reliability of semiconductor devices.
Benefits: - Improved connectivity and reduced risk of malfunctions in electronic devices. - Enhanced durability and longevity of semiconductor devices.
Commercial Applications: Title: Enhanced Chip Connectivity Technology for Electronic Devices This technology can be utilized in the manufacturing of smartphones, tablets, laptops, and other consumer electronics to enhance their performance and reliability. It can also be integrated into industrial equipment and automotive systems to ensure secure connections between chips.
Prior Art: Readers interested in exploring prior art related to this technology can start by researching patents and publications in the field of semiconductor devices, chip connectivity, and electronic interconnections.
Frequently Updated Research: Researchers in the field of semiconductor technology are constantly working on improving chip connectivity and interconnection methods. Stay updated on the latest advancements in this area to leverage cutting-edge solutions for electronic devices.
Questions about Chip Connectivity Technology: 1. How does this technology compare to traditional methods of chip interconnection? This technology offers a more reliable and secure way to connect chips compared to traditional methods, reducing the risk of faulty connections and improving overall device performance.
2. What are the potential challenges in implementing this technology on a large scale? Implementing this technology on a large scale may require significant investment in manufacturing processes and equipment. Additionally, ensuring compatibility with existing electronic devices could be a challenge that needs to be addressed.
Original Abstract Submitted
an object is to provide a semiconductor device and an electronic device that can suppress faulty connections between different chips. the semiconductor device includes: a first chip that includes an insulating layer and a plurality of wiring layers having wires formed in the insulating layer; and at least one second chip that is mounted on the first chip and includes a plurality of conductive portions, wherein the first chip includes a plurality of pad layers and connecting structures, each being formed to electrically connect the pad layer and the conductive portion, the plurality of pad layers being formed at least in the plurality of different wiring layers.
