18365726. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)

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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Organization Name

SK hynix Inc.

Inventor(s)

Yong Jin Jeong of Icheon (KR)

Sang Gu Yeo of Icheon (KR)

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18365726 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Simplified Explanation:

This semiconductor device includes a memory cell with a variable resistance layer, connected to a word line and a bit line that intersect each other.

Key Features and Innovation:

  • First contact plug
  • Word line extending in a first direction
  • Second contact plug
  • Bit line extending in a second direction
  • Memory cell with variable resistance layer

Potential Applications:

This technology can be used in various memory storage applications, such as non-volatile memory devices and resistive random-access memory (ReRAM) devices.

Problems Solved:

This technology addresses the need for high-density, low-power memory solutions with improved performance and reliability.

Benefits:

  • Increased memory density
  • Lower power consumption
  • Enhanced performance and reliability

Commercial Applications:

Potential commercial applications include data storage devices, IoT devices, and mobile devices, where high-density and low-power memory solutions are crucial for efficient operation.

Questions about Semiconductor Devices:

1. How does the variable resistance layer in the memory cell contribute to the device's performance? 2. What are the key advantages of using a word line and bit line configuration in this semiconductor device?

Frequently Updated Research:

Researchers are continually exploring new materials and designs to further improve the performance and efficiency of semiconductor memory devices.


Original Abstract Submitted

A semiconductor device may include a first contact plug, a word line electrically connected to the first contact plug and extending in a first direction, a second contact plug, a bit line extending in a second direction that intersects the first direction, and a memory cell disposed between the word line and the bit line and including a variable resistance layer. The bit line may include a first protruding part that protrudes into the memory cell, a second protruding part that is connected to the second contact plug, and a connection part that connects the first protruding part and the second protruding part and that extends in the second direction.