Sony semiconductor solutions corporation (20240347428). SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME simplified abstract

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SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME

Organization Name

sony semiconductor solutions corporation

Inventor(s)

Yutaka Ootaki of Kanagawa (JP)

SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240347428 titled 'SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME

Simplified Explanation: The patent application describes a lead frame designed to provide effective heat dissipation for semiconductor chips in large-scale circuits. The lead frame includes a mounting surface for the semiconductor chip and heat-dissipating portions composed of plate-shaped fins around the mounting portion.

  • The lead frame has a mounting surface for a semiconductor chip with heat dissipation properties.
  • Heat-dissipating portions consist of plate-shaped fins surrounding the mounting portion.
  • The lead frame is attached to the rear surface of the semiconductor device package.

Key Features and Innovation:

  • Mounting surface with heat dissipation properties for effective heat dissipation.
  • Plate-shaped heat-dissipating fins for enhanced cooling.
  • Attachment to the rear surface of the semiconductor device package for efficient heat dissipation.

Potential Applications: The technology can be applied in various electronic devices requiring effective heat dissipation, such as computers, smartphones, and automotive electronics.

Problems Solved: The technology addresses the issue of heat buildup in semiconductor chips in large-scale circuits, ensuring optimal performance and longevity of electronic devices.

Benefits:

  • Improved heat dissipation for semiconductor chips.
  • Enhanced performance and reliability of electronic devices.
  • Extended lifespan of electronic components.

Commercial Applications: The technology can be utilized in the manufacturing of electronic devices to improve their performance and reliability, potentially leading to increased market competitiveness.

Prior Art: Prior art related to this technology may include patents or research papers on heat dissipation methods for semiconductor devices and electronic components.

Frequently Updated Research: Researchers may be conducting studies on advanced heat dissipation techniques for electronic devices to further enhance performance and reliability.

Questions about Heat Dissipation Technology: 1. How does the lead frame design contribute to effective heat dissipation for semiconductor chips? 2. What are the potential implications of this technology for the electronics industry?


Original Abstract Submitted

to provide a lead frame with a high heat dissipation effect capable of taking effective heat dissipation measures even for semiconductor chips in large-scale circuits. a heat-dissipating lead frame includes: a mounting surface for mounting a semiconductor chip formed of a material having heat dissipation properties and provided at a center on a front surface side of a mounting portion; and a number of heat-dissipating portions composed of a number of plate-shaped heat-dissipating fins provided around the mounting portion. with the mounting front surface facing the front surface of the semiconductor package, the mounting surface is fitted into an opening provided in a semiconductor device package, and the lead frame is attached to the rear surface of the semiconductor device package.

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