18151943. PAD REMOVAL METHOD AND DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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PAD REMOVAL METHOD AND DEVICE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

ChunHung Chen of Hsinchu (TW)

Sheng-Chen Wang of Hsinchu (TW)

PAD REMOVAL METHOD AND DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18151943 titled 'PAD REMOVAL METHOD AND DEVICE

Simplified Explanation

The abstract describes a method for removing a pad by affixing a pad guide to two locations on the pad and then moving one end of the guide to a different position.

  • The method involves attaching a pad guide to a pad at two different locations.
  • One end of the pad guide is moved from its initial position to a different position.
  • The distance between the two positions is greater than the diameter of the pad.
  • The second position is closer to the second location on the pad and has a distance less than the width of the pad.

Potential Applications

  • This method can be used in various industries where pads need to be removed, such as in manufacturing processes or medical applications.
  • It can be applied to remove pads from surfaces that require regular maintenance or replacement.

Problems Solved

  • The method provides a controlled and efficient way to remove pads without causing damage to the pad or the surface it is attached to.
  • It eliminates the need for manual removal methods that can be time-consuming and potentially result in damage.

Benefits

  • The pad removal method ensures precise and accurate removal of pads.
  • It reduces the risk of damage to the pad or the surface it is attached to.
  • The method is efficient and can save time in pad removal processes.


Original Abstract Submitted

A pad removal method includes affixing a first end of a pad guide to a first location of a pad. The method further includes affixing a second end of the pad guide to a second location of the pad. The method further includes moving the first end from a first position, a first distance from the second location, to a second position, a second distance from the second location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the width of the pad.

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