Robert bosch gmbh (20240349429). ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN TWO CIRCUIT CARRIERS, AND METHOD FOR PRODUCING SAME simplified abstract
ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN TWO CIRCUIT CARRIERS, AND METHOD FOR PRODUCING SAME
Organization Name
Inventor(s)
Arne Stephen Fischer of Leifikden-Echterdingen (DE)
Hartmut Wayand of Pfullingen (DE)
Johannes Meckbach of Tuebingen (DE)
Lukas Loeber of Ludwigsburg (DE)
Thomas Kiedrowski of Sersheim (DE)
ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN TWO CIRCUIT CARRIERS, AND METHOD FOR PRODUCING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240349429 titled 'ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN TWO CIRCUIT CARRIERS, AND METHOD FOR PRODUCING SAME
Simplified Explanation: The patent application describes an electronic assembly with a power semiconductor component and a circuit carrier. The power semiconductor component is in electrical contact with the circuit carrier through a connecting layer with a solder connection.
- The electronic assembly includes a power semiconductor component and a circuit carrier.
- The power semiconductor component has contact regions on opposite sides.
- The contact region facing the circuit carrier is in electrical contact with a connection region of the circuit carrier.
- The power semiconductor component is also in electrical contact with a further circuit carrier on the side facing away from the first circuit carrier.
- A connecting layer, generated additively, is arranged on the contact region and/or the connection region of the circuit carriers.
- The connecting layer is connected to the connection region and/or the contact region using a solder connection.
- The connecting layer has a lower modulus of elasticity perpendicular to the surface of the power semiconductor component compared to parallel to the surface.
Potential Applications: This technology can be applied in power electronics, automotive electronics, renewable energy systems, and industrial automation.
Problems Solved: This technology solves the problem of efficiently connecting power semiconductor components to circuit carriers while maintaining mechanical stability.
Benefits: The benefits of this technology include improved electrical connectivity, enhanced mechanical stability, and increased reliability in electronic assemblies.
Commercial Applications: Title: Advanced Electronic Assembly for Power Semiconductor Components This technology can be utilized in the manufacturing of power inverters, motor drives, solar inverters, and other high-power electronic devices. It can lead to more efficient and reliable electronic systems in various industries.
Prior Art: Prior art related to this technology may include research on advanced soldering techniques for electronic components and methods for improving the mechanical properties of electronic assemblies.
Frequently Updated Research: Researchers are continuously exploring new materials and techniques to further enhance the performance and reliability of electronic assemblies with power semiconductor components.
Questions about Electronic Assemblies with Power Semiconductor Components: 1. How does the connecting layer improve the electrical connectivity of the power semiconductor component? 2. What are the potential challenges in implementing this technology in high-power electronic systems?
Original Abstract Submitted
an electronic assembly having a power semiconductor component and a circuit carrier. the power semiconductor component has a contact region on opposite sides; the contact region facing the circuit carrier is in electrical contact with a connection region of the circuit carrier; the power semiconductor component is in electrical contact on the side facing away from the circuit carrier, in the region of the contact region, with a further circuit carrier; an additively generated connecting layer is arranged on the contact region and/or the connection region of the circuit carriers; and the connecting layer is connected to the connection region and/or the contact region using a solder connection. the connecting layer has a lower modulus of elasticity in a direction or plane extending perpendicularly to the surface of the power semiconductor component than in a direction or plane extending in parallel with the surface of the power semiconductor component.
