18745805. PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME simplified abstract (Dell Products L.P.)
PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME
Organization Name
Inventor(s)
Subramanian Vasudevan of Cedar Park TX (US)
Edward Rhem of Leander TX (US)
Philip Conde of Austin TX (US)
Wallace Ables of Georgetown TX (US)
Edwin C. Tinsley of Austin TX (US)
PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18745805 titled 'PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME
Simplified Explanation: The patent application discloses board assembly processes using multiple electrically conductive solder types to attach different electronic components to a printed circuit board (PCB).
- Multiple electronic components can be attached to a common PCB using a multiple-step assembly process.
- The assembly process may involve different solder reflow temperatures and incorporate multiple solder types with varying minimum reflow temperatures.
- Various forms of solder, such as solder paste, wire solder, and ingot solder, can be used in the processes.
Key Features and Innovation:
- Utilizing multiple electrically conductive solder types for board assembly.
- Performing assembly processes at different solder reflow temperatures.
- Incorporating various forms of solder for attaching electronic components to a PCB.
Potential Applications: The technology can be applied in the electronics manufacturing industry for assembling various electronic devices, such as smartphones, computers, and IoT devices.
Problems Solved:
- Providing flexibility in board assembly processes.
- Allowing for the attachment of different electronic components with varying solder requirements.
Benefits:
- Enhanced versatility in board assembly.
- Improved efficiency in attaching electronic components.
- Potential cost savings in manufacturing processes.
Commercial Applications: The technology can be utilized by electronics manufacturers to streamline board assembly processes, increase production efficiency, and potentially reduce manufacturing costs.
Questions about Board Assembly Processes: 1. How do different solder types impact the assembly of electronic components on a PCB? 2. What are the advantages of using multiple-step assembly processes with varying solder reflow temperatures?
Original Abstract Submitted
Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.
