18295287. SPEAKER MODULE FOR AN INFORMATION HANDLING SYSTEM simplified abstract (Dell Products L.P.)
Contents
SPEAKER MODULE FOR AN INFORMATION HANDLING SYSTEM
Organization Name
Inventor(s)
CHIA-HUNG Shih of Taipei City (TW)
CHIN-CHUNG Wu of New Taipei City (TW)
CHIEN-YU Huang of New Taipei City (TW)
CHUN-KAI Tzeng of Keelung City (TW)
SPEAKER MODULE FOR AN INFORMATION HANDLING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18295287 titled 'SPEAKER MODULE FOR AN INFORMATION HANDLING SYSTEM
The abstract describes a speaker module with a speaker enclosure and a transducer coupled to a rubber cap, which is positioned between the transducer and the speaker enclosure.
- The speaker module includes a speaker enclosure with a recessed portion.
- The transducer has a top surface, a bottom surface, and a perimeter surface.
- A rubber cap surrounds the transducer and includes a slot along its inside perimeter.
- The transducer is positioned within the recessed portion of the speaker enclosure.
- The rubber cap is positioned between the transducer and the speaker.
Potential Applications: - This speaker module can be used in various audio devices such as speakers, headphones, and sound systems. - It can be integrated into electronic devices like smartphones, tablets, and laptops for improved audio quality.
Problems Solved: - Provides a secure and efficient way to couple the transducer to the speaker enclosure. - Helps in reducing vibrations and improving sound quality by isolating the transducer.
Benefits: - Enhanced audio performance due to the secure coupling of the transducer. - Improved durability and longevity of the speaker module. - Reduction in unwanted vibrations for clearer sound output.
Commercial Applications: Title: Innovative Speaker Module for Enhanced Audio Performance This technology can be utilized in the consumer electronics industry for manufacturing high-quality audio devices with superior sound output. It can cater to the growing demand for premium audio products in the market, offering a competitive edge to companies in the industry.
Questions about the technology: 1. How does the rubber cap contribute to the overall performance of the speaker module? - The rubber cap helps in isolating the transducer, reducing vibrations, and improving sound quality. 2. What are the potential market implications of integrating this speaker module into electronic devices? - The market implications include increased demand for audio devices with superior sound quality, leading to potential growth opportunities for manufacturers.
Original Abstract Submitted
A speaker module, including: a speaker enclosure, including: a recessed portion; a transducer, including: a top surface; a bottom surface; a perimeter surface positioned between the top surface and the bottom surface; a rubber cap including: a top side; a bottom side; and edges extending between the top side and the bottom side, wherein the edges define an inside perimeter of the rubber cap and include a slot extending along the inside perimeter of the rubber cap, wherein, the transducer is coupled to the rubber cap such that the rubber cap surrounds the transducer and the perimeter surface of the transducer is positioned within the slot of the plurality of edges of the rubber cap, wherein, the transducer is coupled to the speaker enclosure such that the transducer is positioned within the recessed portion of the speaker enclosure and the rubber cap is positioned between the transducer and the speaker.
